Remtec Introduces High Definition Etchable Thick Film (HDTF) Gold Process on Ceramic

Remtec Introduces High Definition Etchable Thick Film (HDTF) Gold Process on Ceramic

Norwood, MA. February 15, 2018. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has commercialized etchable gold thick film process for High Definition Thick Film (HDTF) circuitry as a low-cost alternative to thin films. Remtec’s new offering represents a significant advancement in miniaturization, circuit density and performance. Remtec’s new etchable gold substrates allow the use of ultra-fine lines with a standard line / spacing resolution of 50/50 μm (.002”) and premium circuit of 25/25 μm (.001”). Circuit designers can also benefit from Remtec’s capability for added value features available on the same substrate. In addition to an etchable gold circuit, Remtec’s HDTF can incorporate conductor multilayers. It also integrates built-in components such as Lang couplers, inductors, filters and high precision resistors in a wide range from 50 mΩ to 1 MΩ laser trimmed to ±1% on the same ceramic base. Remtec supports the new line of advanced HDTF substrates with new, state-of- the art processing equipment in a class 1000 clean room. Design engineers can also take advantage of Remtec’s well-known core competency technologies such as AgENIG® (Electroless Nickel Immersion Gold on Silver) and PCTF® (Plated Copper on Thick Films) metallization in their ceramic package designs. Typical applications of Remtec’s etchable gold HDTF ceramic metallization are for products requiring high circuit density and conductor proximity. HDTF substrates used for high performance products such as mm wave microwave circuits and high pin count analog and digital designs. They are ideal for radar, missile and satellite communications systems in both defense and industrial applications. Remtec, a RoHS compliant, ISO 9001:2008 registered and ITAR compliant company, operates a manufacturing facility of 33,000 sq. ft. in Norwood, MA. Remtec produces custom and semi-custom packaging solutions for...
Remtec Adds Gold Tin Plated Ceramic Combo Lids to Complement its Ceramic SMT Packages

Remtec Adds Gold Tin Plated Ceramic Combo Lids to Complement its Ceramic SMT Packages

Norwood, MA. May 12, 2017. RemtecInc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submountsusing PCTF®(Plated Copper on Thick Film) metallization, has added gold tin plated Ceramic Combo Lids to its line of ceramic SMT packages. Now designers can complement a full line of hermetic, ceramic SMT substrates and packages with high reliability gold tin plated Remtechas developed a proprietary technique combining PCTF metallization and gold tin plating to produce the high reliability Ceramic Combo Lids. Remtec’sCombo Lids provide labor savings via the elimination of manual preform attachment, especially on small profile applications. In addition, an unique gold tin plating technology greatly reduces the amount of solder voids common for lids with tack-welded gold tin preforms, thus resulting in higher production yields. Remtec’sCeramic Combo Lids are available in two types: a flat gold tin plated lid and a five-sided box or “cavity lid”. Both styles exhibit excellent void-free soldering ensuring full hermeticitywhen used with high reliability hermetic substrates or packages. Remtec’sproprietary manufacturing process provides uniform gold tin flow and the ability to vary the thickness according to the needs of the application. Remtec’sceramic lids meet military standards and are available in prototype, small lot, and production quantities. The applications for Remtec’snew gold tin plated Ceramic Combo Lids include military, aerospace, avionics and high reliability electronics. Remtec, a RoHS compliant, ISO 90001:2008 registered and ITAR compliant company, operates a manufacturing facility (totaling 33,000 sq. ft.) in Norwood, MA. Remtecproduces custom and semi-custom packaging solutions for sensors and detectors, RF/MW products, DC power electronics, optoelectronics and other high density and power circuitry in commercial, industrial and military...
Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates.

Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates.

Norwood, MA. March 24, 2017. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond Copper (DBC) substrates. Now circuit designers are able to interconnect both sides of DBC substrates with either PTV® copper plugged vias or copper coated through-holes. Remtec’s new PTV® vias adapted for direct bond substrates benefit from the well-known quality of curamik® DBC ceramics coupled with Remtec’s innovative copper via plugging and plating process. The added values of Remtec’s new DBC alumina and Aluminum Nitride ceramics with PTV® vias are higher connectivity and circuit density as well as a high current carrying capacity. Remtec’s new Power Transfer Vias for DBC substrates are hermetic to 10-8 and have a low dc resistance of 1-5 milliohm per via depending on a via size and ceramic thickness. Combining a number of vias into an array allows running currents in excess of 50 AMP. These newly developed DBC substrates with vias can withstand a wide temperature range required for all common assembly methods such as SMT reflow solder, gold tin, gold germanium and Cu-Sil brazing. Adapting PTV® vias for DBC technology allowed Remtec to significantly expand its product offering for applications requiring higher power and integration levels with space limitations and a need for wire feed-through, installation of pins or terminal headers, high current low resistance and top-to-bottom interconnects. Remtec’s Power Transfer Vias with DBC substrates are used in high power and current electronic assemblies with efficient heat removal in commercial, industrial and military / space markets....
Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.

Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.

Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal packaging capabilities of parent company, LTI (www.legacytechnologies.com).