Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.

Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.

Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal packaging capabilities of parent company, LTI (www.legacytechnologies.com).

Remtec Has Been Acquired by LTI, A Leading Manufacturer of Precision Glass-To-Metal Seals

Norwood, MA. December 2 2015. Remtec Inc., the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages. In making the announcement to employees and customers, Remtec President Nahum Rapoport said, “I am pleased to announce that Remtec has been acquired by LTI, Inc., a company that addresses similar markets and customers that should greatly help in continuing product enhancements and development. Remtecwill remain an independent company operating under the existing management team at the present location. I will continue to serve as President of Remtecand as a Remtecand LTI Board member. Remtec’scustomers will continue to interact with the same professionals from our customer service, engineering, and application engineering teams.” Bruce Diggett, LTI president and CEO, said “the acquisition will benefit LTI’s domestic and international customers, as the combined companies will have even greater resources for product innovation, manufacturing efficiencies and customer service.” Rapoportadded, “The acquisition creates a synergistic partnership between ceramic and glass-to-metal packaging companies who can now share their engineering expertise and manufacturing capabilities, as well as similar marketing and sales strategies.” With both companies participating in similar markets, product innovations in those markets can be expected. LTI manufactures glass-to-metal seal hermetic packages, high reliability precision quartz crystal holders and specialized solutions for aerospace, defense, telecommunications, medical, automotive and sensor applications. LTI is a RoHS and ISO compliant and ITAR registered company located in Mission, Kansas. Remtecprovides custom and semi-custom packaging solutions using PCTF (Plated Copper on Thick Film) metallization on...
Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities.

Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities.

Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities. Norwood, MA, January 19 2015. Remtec Inc.(www.remtec.com), the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options. Solder mask options include liquid photo image-able LPI for higher resolution patterns, high operating temperature (400oC) solder mask and elevated reflectivity mask for high luminance requirements typical for LED applications. Finally, Remtec complements DBC substrate fabrication with assembly capabilities including flying leads and pin/lug attachment onto metallized ceramics using CuSIL (copper-silver alloy) brazing and AuSn (gold tin) soldering. Remtec offers a wide variety of DBC products on alumina and aluminum nitride with many versatile copper finish options including selective gold tin to ensure excellent solderability, wire bondability and product reliability. The use of palladium plating enables economical assembly techniques including SMT soldering, low and high temperature die attach, aluminum wire, gold wire and ribbon bonding. Now designers can utilize front-to-back connections, wire and terminal connections, flow-controlling solder mask and lead, pin and lug attachments on DBC substrates. Added DBC capabilities allow Remtec to address more applications in defense, aerospace, industrial power, medical instrumentation and green technologies. Remtec, a RoHS compliant, ISO 9001:2008 registered and ITAR compliant company, operates a manufacturing facility totaling 33,000 sq. ft. in Norwood, MA. Remtec provides custom and semi-custom packaging...
Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JEDEC TO-Style Window Lids for Optoelectronic Circuits

Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JEDEC TO-Style Window Lids for Optoelectronic Circuits

Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JEDEC TO-Style Window Lids for Optoelectronic Circuits. Norwood, MA, December 23. 2014. Remtec Inc.,(www.remtec.com) the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has applied its time proven leadless ceramic SMT substrate technology to the development of a new line of standard SMT leadless packages for electro optical circuits matching standard TO type window lids. These new packages address the longstanding demands of the photonics industry for an SMT packaging solution as a viable alternative to standard TO type packages. Now standard economical surface mounted packages can be produced for a wide range of circuits and I/O configurations fully compatible with most of JEDEC TO-style window caps such as TO-8, TO-46 and beyond at operating frequencies up to 10 GHz and higher. This approach reduces the total design cycle, minimizes tooling and engineering costs and reduces end user assembly costs. Remtec’s ability to use standard TO-style lids on a surface-mountable substrate eliminates the need for through-hole mounting of the device on the PCB. More importantly, the device assembly can be done in multiple up panel format resulting in additional cost savings. Remtec’s new SMT packages for optoelectronic circuits are based on extensive experience in design and manufacturing of various products for RF, photonics and other industries. Remtec’s expertise in the design and fabrication of RF substrates and packages complements its capability in the fabrication of substrates and submounts for laser and photo diodes, LEDs, sensors and detectors. This experience extends to a broad use of its PCTF® technology for surface mounted...
Remtec Expands LED Packaging Capabilities And Adds New Economical Metallization Technologies, Custom Tailored for Specific Customer Requirements

Remtec Expands LED Packaging Capabilities And Adds New Economical Metallization Technologies, Custom Tailored for Specific Customer Requirements

Norwood, MA, November 3, 2014. Remtec Inc., the leading manufacturer of substrates and packages using PCTF® (Plated Copper On Thick / Thin Film) metallization, has expanded its LED substrate and submount design and manufacturing capabilities by adding new features such as bond-pad down (flip-chip) packaging with a cathode-anode gap as small as 75-50μ and selective gold-tin plating. As a result, Remtec can now produce higher performance, lower cost metallized LED substrates and submounts using added benefits, each custom tailored to a specific customer requirement matching the required performance and power level or assembly methods. Remtec LED substrates and submounts utilize a variety of metallization technologies on alumina, AIN and BeO ceramics: PCTF® with 20-75μm copper, AgENIG® (Electroless Nickel and Immersion Gold over Silver) and DBC (Direct Bond Copper) with 125-250μm copper. Remtec has developed LED substrates for bond-pad down devices allowing “narrow gap” capability for 50 μm wide gaps suitable for InGaN, GaAs and other LED devices. It enables direct eutectic dieattach, eliminating the need for wire bonds and ensures superior thermal and electrical performance for the next generation of solid-state LED devices. Remtec’s lower cost, high performance gold tin plating that is selectively applied over basic metallization eliminates bulky solder preforms and ensures void-free solder joints in LED substrates and submounts. Finally, using these new capabilities and refined manufacturing techniques, Remtec is able to offer LED assembly manufacturers reliable solutions, competitive pricing, low upfront tooling costs and fast turnaround times without any compromise in quality or performance. In addition to traditional LED lighting markets, Remtec is expanding LED substrates and submounts for non-invasive medical diagnostics, dental, printing and other...