Remtec Adds Gold Tin Plated Ceramic Combo Lids to Complement its Ceramic SMT Packages

Remtec Adds Gold Tin Plated Ceramic Combo Lids to Complement its Ceramic SMT Packages

Norwood, MA. May 12, 2017. RemtecInc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submountsusing PCTF®(Plated Copper on Thick Film) metallization, has added gold tin plated Ceramic Combo Lids to its line of ceramic SMT packages. Now designers can complement a full line of hermetic, ceramic SMT substrates and packages with high reliability gold tin plated Remtechas developed a proprietary technique combining PCTF metallization and gold tin plating to produce the high reliability Ceramic Combo Lids. Remtec’sCombo Lids provide labor savings via the elimination of manual preform attachment, especially on small profile applications. In addition, an unique gold tin plating technology greatly reduces the amount of solder voids common for lids with tack-welded gold tin preforms, thus resulting in higher production yields. Remtec’sCeramic Combo Lids are available in two types: a flat gold tin plated lid and a five-sided box or “cavity lid”. Both styles exhibit excellent void-free soldering ensuring full hermeticitywhen used with high reliability hermetic substrates or packages. Remtec’sproprietary manufacturing process provides uniform gold tin flow and the ability to vary the thickness according to the needs of the application. Remtec’sceramic lids meet military standards and are available in prototype, small lot, and production quantities. The applications for Remtec’snew gold tin plated Ceramic Combo Lids include military, aerospace, avionics and high reliability electronics. Remtec, a RoHS compliant, ISO 90001:2008 registered and ITAR compliant company, operates a manufacturing facility (totaling 33,000 sq. ft.) in Norwood, MA. Remtecproduces custom and semi-custom packaging solutions for sensors and detectors, RF/MW products, DC power electronics, optoelectronics and other high density and power circuitry in commercial, industrial and military...
Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates.

Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates.

Norwood, MA. March 24, 2017. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond Copper (DBC) substrates. Now circuit designers are able to interconnect both sides of DBC substrates with either PTV® copper plugged vias or copper coated through-holes. Remtec’s new PTV® vias adapted for direct bond substrates benefit from the well-known quality of curamik® DBC ceramics coupled with Remtec’s innovative copper via plugging and plating process. The added values of Remtec’s new DBC alumina and Aluminum Nitride ceramics with PTV® vias are higher connectivity and circuit density as well as a high current carrying capacity. Remtec’s new Power Transfer Vias for DBC substrates are hermetic to 10-8 and have a low dc resistance of 1-5 milliohm per via depending on a via size and ceramic thickness. Combining a number of vias into an array allows running currents in excess of 50 AMP. These newly developed DBC substrates with vias can withstand a wide temperature range required for all common assembly methods such as SMT reflow solder, gold tin, gold germanium and Cu-Sil brazing. Adapting PTV® vias for DBC technology allowed Remtec to significantly expand its product offering for applications requiring higher power and integration levels with space limitations and a need for wire feed-through, installation of pins or terminal headers, high current low resistance and top-to-bottom interconnects. Remtec’s Power Transfer Vias with DBC substrates are used in high power and current electronic assemblies with efficient heat removal in commercial, industrial and military / space markets....
Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.

Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.

Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal packaging capabilities of parent company, LTI (www.legacytechnologies.com).

Remtec Has Been Acquired by LTI, A Leading Manufacturer of Precision Glass-To-Metal Seals

Norwood, MA. December 2 2015. Remtec Inc., the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages. In making the announcement to employees and customers, Remtec President Nahum Rapoport said, “I am pleased to announce that Remtec has been acquired by LTI, Inc., a company that addresses similar markets and customers that should greatly help in continuing product enhancements and development. Remtecwill remain an independent company operating under the existing management team at the present location. I will continue to serve as President of Remtecand as a Remtecand LTI Board member. Remtec’scustomers will continue to interact with the same professionals from our customer service, engineering, and application engineering teams.” Bruce Diggett, LTI president and CEO, said “the acquisition will benefit LTI’s domestic and international customers, as the combined companies will have even greater resources for product innovation, manufacturing efficiencies and customer service.” Rapoportadded, “The acquisition creates a synergistic partnership between ceramic and glass-to-metal packaging companies who can now share their engineering expertise and manufacturing capabilities, as well as similar marketing and sales strategies.” With both companies participating in similar markets, product innovations in those markets can be expected. LTI manufactures glass-to-metal seal hermetic packages, high reliability precision quartz crystal holders and specialized solutions for aerospace, defense, telecommunications, medical, automotive and sensor applications. LTI is a RoHS and ISO compliant and ITAR registered company located in Mission, Kansas. Remtecprovides custom and semi-custom packaging solutions using PCTF (Plated Copper on Thick Film) metallization on...
Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities.

Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities.

Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities. Norwood, MA, January 19 2015. Remtec Inc.(www.remtec.com), the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options. Solder mask options include liquid photo image-able LPI for higher resolution patterns, high operating temperature (400oC) solder mask and elevated reflectivity mask for high luminance requirements typical for LED applications. Finally, Remtec complements DBC substrate fabrication with assembly capabilities including flying leads and pin/lug attachment onto metallized ceramics using CuSIL (copper-silver alloy) brazing and AuSn (gold tin) soldering. Remtec offers a wide variety of DBC products on alumina and aluminum nitride with many versatile copper finish options including selective gold tin to ensure excellent solderability, wire bondability and product reliability. The use of palladium plating enables economical assembly techniques including SMT soldering, low and high temperature die attach, aluminum wire, gold wire and ribbon bonding. Now designers can utilize front-to-back connections, wire and terminal connections, flow-controlling solder mask and lead, pin and lug attachments on DBC substrates. Added DBC capabilities allow Remtec to address more applications in defense, aerospace, industrial power, medical instrumentation and green technologies. Remtec, a RoHS compliant, ISO 9001:2008 registered and ITAR compliant company, operates a manufacturing facility totaling 33,000 sq. ft. in Norwood, MA. Remtec provides custom and semi-custom packaging...