by remtec1 | Apr 6, 2018 | News, Press Releases
Norwood, MA. February 15, 2018. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has commercialized etchable gold thick film process for High Definition Thick...
by remtec1 | Jun 7, 2017 | News, Press Releases
Norwood, MA. May 12, 2017. RemtecInc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submountsusing PCTF®(Plated Copper on Thick Film) metallization, has added gold tin plated Ceramic Combo Lids to its line of ceramic SMT packages. Now...
by remtec1 | Mar 27, 2017 | News, Press Releases
Norwood, MA. March 24, 2017. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond...
by remtec1 | Jun 2, 2016 | News, Press Releases
Norwood, MA. May 31, 2016. Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal...
by remtec1 | Mar 14, 2016 | News, Press Releases
Norwood, MA. March 10, 2016. Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF®(Plated Copper on Thick Film) metallization, has significantly expanded its assembly capability on its metallized ceramic...
by remtec1 | Jan 20, 2015 | News, Press Releases
Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities. Norwood, MA, January 19 2015. Remtec Inc.(www.remtec.com), the leading manufacturer of substrates and packages...