HIGH DENSITY THICK FILM SUBSTRATES
Remtec offers an optimal combination of economy, performance and reliability meeting the challenges of demanding electronic applications.
include both traditional gold multilayer thick films with excellent wire bondability, solderability and conductor
adhesion and lower cost multilayer circuits utilizing silver interlayer conductors with higher conductivity of 1-3 mΩ/sq.
Optional Ni-Au plating on a top conductor layer of a multilayer pattern results in enhanced reliability circuits with a
high leach resistance, fully compatible with high temperature RoHS compliant SAC solders. Also available are etched thick films with 0.002″ minimum line/space and ±0.00025” line/gap tolerance. Dielectrics for either gold or silver conductors ensure insulation to 1,000 V. Dielectric constant can be adjusted from 6-12. Printed resistors in mΩ to GΩ range with tolerances of 1-10% are typically protected with overglaze materials.
Product integrity, reliability and repeatability is a result of using state-of-the-art equipment and processes including
automated cassette-to-cassette screen printing and firing, high speed step-and-repeat laser trim, photolithography and dicing.
High product quality is based on intensive direct labor training program, supplier evaluation, material analysis,
wide use of SPC methodology and product/process qualifications as well as routine process auditing. Lot acceptance and test procedures strictly adhere to applicable requirements of MIL-STD-883, MIL-STD-202, MIL-PRF-38534 and detailed internal specifications.
The sales and applications engineering team at Remtec is staffed to provide a diverse customer base with rapid response, short lead time and problem solving support. Remtec, a RoHS compliant, ISO 9001:2008 certified and ITAR compliant company, supplies multilayer substrates in low, medium and high volumes for military, avionics, space and industrial applications.