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Remtec Adds Gold Tin Plated Ceramic Combo Lids to Complement its Ceramic SMT Packages

Norwood, MA. May 12, 2017. RemtecInc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submountsusing PCTF®(Plated Copper on Thick Film) metallization, has added gold tin plated Ceramic Combo Lids to its line of ceramic SMT packages. Now designers can complement a full line of hermetic, ceramic SMT substrates and packages with high reliability gold tin plated Remtechas developed a proprietary technique combining PCTF metallization and gold tin plating to produce the high reliability Ceramic Combo Lids. Remtec’sCombo Lids provide labor savings via the elimination of manual preform attachment, especially on small profile applications. In addition, an unique gold tin plating technology greatly reduces the amount of solder voids common for lids with tack-welded gold tin preforms, thus resulting in higher production yields. Remtec’sCeramic Combo Lids are available in two types: a flat gold tin plated lid and a five-sided box or “cavity lid”. Both styles exhibit excellent void-free soldering ensuring full hermeticitywhen used with high reliability hermetic substrates or packages. Remtec’sproprietary manufacturing process provides uniform gold tin flow and the ability to vary the thickness according to the needs of the application. Remtec’sceramic lids meet military standards and are available in prototype, small lot, and production quantities. The applications for Remtec’snew gold tin plated Ceramic Combo Lids include military, aerospace, avionics and high reliability electronics. Remtec, a RoHS compliant, ISO 90001:2008 registered and ITAR compliant company, operates a manufacturing facility (totaling 33,000 sq. ft.) in Norwood, MA. Remtecproduces custom and semi-custom packaging solutions for sensors and detectors, RF/MW products, DC power electronics, optoelectronics and other high density and power circuitry in commercial, industrial and military...

Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates.

Norwood, MA. March 24, 2017. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond Copper (DBC) substrates. Now circuit designers are able to interconnect both sides of DBC substrates with either PTV® copper plugged vias or copper coated through-holes. Remtec’s new PTV® vias adapted for direct bond substrates benefit from the well-known quality of curamik® DBC ceramics coupled with Remtec’s innovative copper via plugging and plating process. The added values of Remtec’s new DBC alumina and Aluminum Nitride ceramics with PTV® vias are higher connectivity and circuit density as well as a high current carrying capacity. Remtec’s new Power Transfer Vias for DBC substrates are hermetic to 10-8 and have a low dc resistance of 1-5 milliohm per via depending on a via size and ceramic thickness. Combining a number of vias into an array allows running currents in excess of 50 AMP. These newly developed DBC substrates with vias can withstand a wide temperature range required for all common assembly methods such as SMT reflow solder, gold tin, gold germanium and Cu-Sil brazing. Adapting PTV® vias for DBC technology allowed Remtec to significantly expand its product offering for applications requiring higher power and integration levels with space limitations and a need for wire feed-through, installation of pins or terminal headers, high current low resistance and top-to-bottom interconnects. Remtec’s Power Transfer Vias with DBC substrates are used in high power and current electronic assemblies with efficient heat removal in commercial, industrial and military / space markets....

Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.

Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal packaging capabilities of parent company, LTI (www.legacytechnologies.com).