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Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates.

Norwood, MA. March 24, 2017. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond Copper (DBC) substrates. Now circuit designers are able to interconnect both sides of DBC substrates with either PTV® copper plugged vias or copper coated through-holes. Remtec’s new PTV® vias adapted for direct bond substrates benefit from the well-known quality of curamik® DBC ceramics coupled with Remtec’s innovative copper via plugging and plating process. The added values of Remtec’s new DBC alumina and Aluminum Nitride ceramics with PTV® vias are higher connectivity and circuit density as well as a high current carrying capacity. Remtec’s new Power Transfer Vias for DBC substrates are hermetic to 10-8 and have a low dc resistance of 1-5 milliohm per via depending on a via size and ceramic thickness. Combining a number of vias into an array allows running currents in excess of 50 AMP. These newly developed DBC substrates with vias can withstand a wide temperature range required for all common assembly methods such as SMT reflow solder, gold tin, gold germanium and Cu-Sil brazing. Adapting PTV® vias for DBC technology allowed Remtec to significantly expand its product offering for applications requiring higher power and integration levels with space limitations and a need for wire feed-through, installation of pins or terminal headers, high current low resistance and top-to-bottom interconnects. Remtec’s Power Transfer Vias with DBC substrates are used in high power and current electronic assemblies with efficient heat removal in commercial, industrial and military / space markets....

Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.

Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal packaging capabilities of parent company, LTI (www.legacytechnologies.com).

Remtec Has Been Acquired by LTI, A Leading Manufacturer of Precision Glass-To-Metal Seals

Norwood, MA. December 2 2015. Remtec Inc., the leading manufacturer of ceramic substrates, packages and submounts using PCTF (Plated Copper on Thick Film) metallization, has been acquired by LTI (www.legacytechnologies.com), a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages. In making the announcement to employees and customers, Remtec President Nahum Rapoport said, “I am pleased to announce that Remtec has been acquired by LTI, Inc., a company that addresses similar markets and customers that should greatly help in continuing product enhancements and development. Remtecwill remain an independent company operating under the existing management team at the present location. I will continue to serve as President of Remtecand as a Remtecand LTI Board member. Remtec’scustomers will continue to interact with the same professionals from our customer service, engineering, and application engineering teams.” Bruce Diggett, LTI president and CEO, said “the acquisition will benefit LTI’s domestic and international customers, as the combined companies will have even greater resources for product innovation, manufacturing efficiencies and customer service.” Rapoportadded, “The acquisition creates a synergistic partnership between ceramic and glass-to-metal packaging companies who can now share their engineering expertise and manufacturing capabilities, as well as similar marketing and sales strategies.” With both companies participating in similar markets, product innovations in those markets can be expected. LTI manufactures glass-to-metal seal hermetic packages, high reliability precision quartz crystal holders and specialized solutions for aerospace, defense, telecommunications, medical, automotive and sensor applications. LTI is a RoHS and ISO compliant and ITAR registered company located in Mission, Kansas. Remtecprovides custom and semi-custom packaging solutions using PCTF (Plated Copper on Thick Film) metallization on...