Remtec Adds Assembly Capability On Its Metallized Ceramic Substrates And Packages.

PR38 Remtec Adds Assembly Capability On Its Metallized Ceramic Substrates And PackagesNorwood, MA. March 10, 2016. Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF®(Plated Copper on Thick Film) metallization, has significantly expanded its assembly capability on its metallized ceramic substrates and packages. As a result of Remtec’s recent merger with LTI of Mission, Kansas, a leader in the production of precision glass-to-metal seals, Remtec is able to offer customers advanced attachment assembly options.

Remtec’s expanded engineering capabilities include a large variety of assembly operations such as standard SMT soldering, gold tin soldering and CuSilbrazing. Typical attachment components are lead-frames, pins, bushings, contacts, connectors and lugs as well as Kovar and ceramic ring-frames for hermetic assembly. Remtec can now build more advanced and complex assemblies on its metallized substrates for various electronic applications and products.

Greatly broadening Remtec’scapabilities is the addition of multiple furnaces with various atmospheres (nitrogen, ammonia and forming gas) that operate at a wide temperature range (200 to 900oC). The addition of welding, the use of sophisticated fixturing and introduction of DBC-to-DBC multi-layer stack-up assembly capability significantly expand Remtec’s product offerings.
Remtec provides custom and semi-custom packaging solutions using PCTF® (Plated Copper on Thick Film) and DBC metallization on alumina, AIN and BeO ceramics.Applications include sensors and detectors, laser, LED and photo diode submounts, RF/MW products, DC power electronics, optoelectronics and other high density and power circuitry in commercial, industrial and military industries. Remtecis a RoHS compliant, ISO 90001:2008 registered and ITAR compliant company operating in a manufacturing facility totaling 33,000 sq. ft. in Norwood, MA.