Resources

Remtec Specs

The following links contain technical information and specifications for Remtec products. These resources are intended to help manufacturing engineers and designers incorporate Remtec’s innovative and cost-effective metallization technologies into your products.

Technical Papers

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Remtec - MW RF PCTF

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Remtec APEC Paper Presentation

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RFHIC MWJ Paper GaN 10W PA

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Teledyne

Data Sheets

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Laser and Photo Diode Submounts

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Specialty Plating

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Direct Bond Copper Substrates

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Leadless Ceramic SMT Substrates, Packages & Components

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Leadless Hermetic Ceramic SMT Substrates & Packages

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Low Cost AgENIG Thick Film Substrates

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Multilayer Thick Film Substrates

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Metallized Substrates, Packages & Components with PCTF Technology

For additional details, contact your Remtec representative.

Contact

We’re Ready to Help You.

Remtec’s team of technical experts will assist you with your metallized ceramic requirements. We provide a complete solution—from prototype design and fabrication to high volume production.

Please send your electronic files in DXF and/or DWG formats to sales@remtec.com. Additional design guidelines are available upon request.