Process Capabilities

  • capabilitiesThick Film on Alumina, Aluminum Nitride, Beryllia, Barium Titanate, Zirconia, Quartz and Glass with Automated magazine-to-magazine print & fire
  • Direct Bond Copper on Alumina, Aluminum Nitride and military grade ceramic
  • Single and double sided copper from .001” to .016” thick
  • Rapid response with Fast turn around
  • Prototype to volume production
  • Complete Engineering, Design, and Application support

123

 

 

 


Specialty Plating

  • Copper – Electrolytic on thick and thin films
  • Gold –Electroless, Immersion, and Electrolytic
  • Nickel –Electroless and Electrolytic
  • Tin – Electrolytic (acid)
  • Gold/Tin Alloy
  • Selective deposit patterning

Solder Stop

  • Dry Film
  • Liquid Photo Imageable for high resolution
  • LED specific Brilliant White
  • High Temperature
  • Laser ablation
  • Selective Nickel barrier

Ceramic Cutting Options

  • Laser machining contours
  • Laser drilling
  • Laser scribing
  • Laser marking
  • Diamond Saw/Dicing
  • Zero Pullback® Metallization

Specialty Processing

  • Solid metal via technology, Au, Ag and Cu both hermetic and non-hermetic vias
  • Plated through holes, bore coating, wraparounds and castellations
  • Stand-offs for SMT attachment
  • Fine line precision etching
  • Integrated printed resistors in wide range
  • High Speed Precision automatic Laser Trim and Test
  • Lapping and polishing copper
  • Pin and Lead-off attachment
  • Tape & Reel packaging

a b c d e f g

 

 

 

 


Quality Assurance Inspection and Testing

  • ISO 9001:2008 Certified
  • Based on selected methods from MIL-STD-883 and MIL-STD-750
  • SPC implemented at critical process operations
  • 100% Inspection in critical applications
  • Zero Based Acceptance Sampling and Sampling IAW ANSI/ASQ Z1.4 are used
  • Broad Test capabilities: electrical, mechanical, adhesion, environmental and functional
  • Thick Film (Au, Ag, Cu) Precision Screen printing and sintering on Alumina, AlN, Beryllia, Barium Titanate, Zirconia, Quartz and Glass.
    • Up to 12×12” substrate format
    • Automated cassette-to-cassette print & fire
    • Solid metal via technology, Au and Ag (hermetic vias)
    • Through hole metallized via holes, wraparounds and castellations
    • Integrated printed resistors in wide range on Alumina, AlN, Beryllia
    • High Speed Precision automatic Laser Trim and Test
  • Thick and Thin Films precision etching
  • Polymer Thick film processing
  • DBC processing
  • LPI and Dry film solder mask
  • Heat and UV material curing
  • Electrolytic copper plating on thick and thin films with the following finish
    • Tin plating up to .002” thick
    • Electrolytic and Electroless nickel and gold  plating
    • Selective Gold Tin Plating
  • Broad Equipment Base (see, cross reference to manufacturing capabilities)
  • Quality Assurance System based on MIL-STD-750 and MIL-STD-883; SPC and AQL sampling, 100% in critical applications
  • Class 100K clean room (10K in selected areas)
  • In house machine shop for production and test fixtures fabrication
  • Broad Test capabilities: electrical, mechanical, adhesion, environmental and functional