by remtec1 | Jan 4, 2019 | News, Press Releases
IEEE IMS International Microwave Symposium 2019
Booth 237
June 4-6
Boston Convention Center
Boston, MA
by remtec1 | Jan 4, 2019 | News, Press Releases
APEC 2019
Booth 235
March 18-20
Anaheim Convention Center
Anaheim, CA
by remtec1 | Jan 4, 2019 | News, Press Releases
SPIE Photonics West 2019
Booth 5570
February 5-7
Moscone Convention Center
San Francisco, CA
by remtec1 | Apr 6, 2018 | News, Press Releases
Norwood, MA. February 15, 2018. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has commercialized etchable gold thick film process for High Definition Thick...
by remtec1 | Jun 7, 2017 | News, Press Releases
Norwood, MA. May 12, 2017. RemtecInc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submountsusing PCTF®(Plated Copper on Thick Film) metallization, has added gold tin plated Ceramic Combo Lids to its line of ceramic SMT packages. Now...