Our Company

Our History

Remtec is founded to serve a growing need in the electronics industry for advanced ceramic packaging technology, primarily for applications requiring high power, heavy circuit density, and a broad operational frequency range.

Remtec engineers develop and test our proprietary Plated Copper on Thick/Thin Film (PCTF®) ceramic metallization technology.


Remtec establishes full production and manufacturing capabilities for the design and fabrication of metallized ceramic substrates, chip carriers, surface-mountable hermetic and non-hermetic ceramic packages, and specialty components for electronic applications.


Remtec acquires a plating company and moves to a new 28,000 sq. ft. facility.


Our facility expands to 33,000 sq. ft. (construction is completed in 2013). The expansion includes the purchase of additional equipment—including automated cassette-to-cassette production and gold tin plating lines—and a substantial upgrade to our capabilities, which enables Remtec to broaden our technology base and product lines.


Remtec is a leading manufacturer of plated copper on thick and thin film substrates, chip carriers, packages, and submounts for laser diodes, photo diodes, and LEDs.


Remtec moves to a new 55,000 sq. ft. state-of-the-art facility.

Our Mission

Our sole mission is to create strong partnerships with our customers through continuous application and engineering support, so as to be a SINGLE source for all their ceramic and packaging needs—from prototype to production.

With a strong engineering background and a commitment to bringing novel technologies to market, the Remtec team employs a wide range of ceramic metallization and packaging technologies—as well as our comprehensive equipment base, modern manufacturing techniques, and diverse industry experience—to solve electronic packaging problems.

Utilizing the latest CAD tools, Remtec application engineers and designers work closely with each customer to develop the most cost-effective manufacturing techniques for their specific requirements.

%title -

Over decades of experience in volume manufacturing, Remtec has refined our patented process for combining plated copper images with thick film on ceramic substrates—a technology we call Plated Copper on Thick Film (PCTF®). This technology enables us to achieve high levels of product uniformity, yield consistency, reliability, and product performance. In fact, with over 100 million gold and aluminum wire bond connections and more than 1 billion solder joint connections, Remtec products have been successfully field-tested across numerous industries without reported failure.

At Remtec, we turn your packaging and assembly problems into effective, reliable, and lasting solutions.

If you require a new and innovative ceramic packaging solution designed to your specifications, then Remtec’s staff of Sales and Engineering experts is here to help you.

Our Facility

Our 55,000 sq. ft., US-based design and manufacturing facility is fully-equipped with state-of-the-art thick film processing and electroplating equipment to facilitate mass production. Remtec subjects all products to rigorous inspection and testing with precision instrumentation and statistical process controls to ensure top quality.

%title - Use for Clean room

A class-100,000 clean-room printing operation with the capacity to produce more than 50,000 metallized substrates per month, using both semi-automatic and fully-automated cassette-to-cassette equipment.

%title - onsite analysis
On-site analysis of all electroplating and autocatalytic plating operations ensures tight plating control and enables adjustments to ensure process uniformity.
%title - X ray flourescence

An X-ray fluorescence system verifies thickness of plated metals in a broad range with great accuracy.

%title - reflow
Under close Remtec supervision, SMT reflow soldering, gold and aluminum wire bonding, and high-temperature brazing capabilities are available via third-party allies — enabling product assembly and testing on PCTF substrates and packages.
%title - photolithography
Photolithography and etching capabilities provide fine-line resolutions with small aspect ratios.
%title - electroplating
State-of-the-art electroplating and autocatalytic plating lines enable a wide variety of surface finishes.
%title - high speed laser trim
High-speed laser trim-and-test system provides fast turn-around and ensures product reliability.
%title - thick film production furnaces
Precision furnaces are customized for all material sets and treatment of ceramic to insure highly reliable adhesion through all material interfaces.


Interested in joining the Remtec team? We have the following open positions. Contact us for more details.

Micro-electronics Packaging Production Technician

CAD/CAM Engineer

We’re always looking for great talent!


Have questions about Remtec or our products? Want more information about our technologies and techniques? Need a solution for your production challenge? Let us know – a team member is ready with answers.