Remtec engineers develop and test our proprietary Plated Copper on Thick/Thin Film (PCTF®) ceramic metallization technology.
Remtec acquires a plating company and moves to a new 28,000 sq. ft. facility.
Our facility expands to 33,000 sq. ft. (construction is completed in 2013). The expansion includes the purchase of additional equipment—including automated cassette-to-cassette production and gold tin plating lines—and a substantial upgrade to our capabilities, which enables Remtec to broaden our technology base and product lines.
Remtec is a leading manufacturer of plated copper on thick and thin film substrates, chip carriers, packages, and submounts for laser diodes, photo diodes, and LEDs.
Remtec moves to a new 55,000 sq. ft. state-of-the-art facility.
Our sole mission is to create strong partnerships with our customers through continuous application and engineering support, so as to be a SINGLE source for all their ceramic and packaging needs—from prototype to production.
With a strong engineering background and a commitment to bringing novel technologies to market, the Remtec team employs a wide range of ceramic metallization and packaging technologies—as well as our comprehensive equipment base, modern manufacturing techniques, and diverse industry experience—to solve electronic packaging problems.
Utilizing the latest CAD tools, Remtec application engineers and designers work closely with each customer to develop the most cost-effective manufacturing techniques for their specific requirements.
Over decades of experience in volume manufacturing, Remtec has refined our patented process for combining plated copper images with thick film on ceramic substrates—a technology we call Plated Copper on Thick Film (PCTF®). This technology enables us to achieve high levels of product uniformity, yield consistency, reliability, and product performance. In fact, with over 100 million gold and aluminum wire bond connections and more than 1 billion solder joint connections, Remtec products have been successfully field-tested across numerous industries without reported failure.
At Remtec, we turn your packaging and assembly problems into effective, reliable, and lasting solutions.
If you require a new and innovative ceramic packaging solution designed to your specifications, then Remtec’s staff of Sales and Engineering experts is here to help you.
Our 55,000 sq. ft., US-based design and manufacturing facility is fully-equipped with state-of-the-art thick film processing and electroplating equipment to facilitate mass production. Remtec subjects all products to rigorous inspection and testing with precision instrumentation and statistical process controls to ensure top quality.
A class-100,000 clean-room printing operation with the capacity to produce more than 50,000 metallized substrates per month, using both semi-automatic and fully-automated cassette-to-cassette equipment.
An X-ray fluorescence system verifies thickness of plated metals in a broad range with great accuracy.