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Data Sheets

Metallized Substrates, Packages & Components with PCTF Technology

Low Cost AgENIGTM Thick Film Substrates

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About Us

Remtec is dedicated to using its wide range of ceramic metallization and packaging technologies as well as its wide-ranging equipment base, modern manufacturing techniques and diverse industry experience to solve your electronic packaging problems. Utilizing the latest CAD tools, Remtec engineers work closely with you to develop the most cost-effective manufacturing techniques for your specific requirements.

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Phone: 781.762.9191
Fax: 781.762.9777
Email:sales@remtec.com

Address:
100 Morse Street
Norwood, MA 02062
USA

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Latest News

  • IEEE IMS International Microwave Symposium 2019 January 4, 2019
  • APEC 2019 January 4, 2019
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