LEADLESS HERMETIC CERAMIC SMT SUBSTRATES AND PACKAGESPCTF® technology offers an optimal combination of economy and performance for high reliability leadless ceramic hermetic SMT packaging.
Remtec designs and manufactures cost effective hermetic ceramic leadless SMT substrates and packages for RF and microwave components as well as multichip modules for direct PCB mount. An SMT package built with PCTF® (Plated Copper on Thick film) Technology includes three essential features: copper metallization, copper-plated solid plugged hermetic via holes, and PCTF wraparounds (castellations). Copper metallization is quite suitable for RF signal transmission and also creates an excellent heat spreading effect beneath a semiconductor die.
Solid via holes and castellations serve multiple functions. They greatly reduce the thermal resistance of the ceramic base and act as signal and ground connections for the package. They also provide low-inductance interconnects, which are essential for good high frequency performance. Plugged via holes exhibit DC resistance below 0.5 m. Solid via holes with thermal conductivity greater than 200 W/mx°C result in thermal resistance below 1°C/W and provide excellent thermal management.
The time-proven capability of directly soldering large leadless ceramic surface-mountable RF modules (greater than 0.75 in. on a side) onto PCBs is a unique benefit. Other benefits are excellent solderability and the capability of withstanding multiple soldering operations at 300°C and higher as well as compliance with RoHS requirements without any degradation in package integrity and reliability.
Technical data are shown on the reverse side.
PCTF® offers RF component and module designers a viable, cost-effective packaging option with low up-front costs and fast market entrance.
heat transfer path with a thermal resistance of approximately 30°C/W per via. An array of 20 plugged vias under a single die of 3 mm x 3mm dissipating 5 W provides the effective thermal resistance of 1.5°C/W, with a resulting temperature
rise of ΔT=7°C.
Typical applications include RF power amplifiers, MMIC modules, encoders, optical drivers, attenuators, filters and transmit-receive modules for radar, satellite, military and aerospace applications.
Please send your electronic files in DXF and/or DWG formats to email@example.com. More detailed design guidelines are available upon request.
Remtec, a RoHS compliant and ISO 9001: 2000 registered company, provides ceramic packaging solutions for microwave/RF components and modules, optoelectronics and power electronics.
Additional data are available at www.remtec.com