LED SUBSTRATES AND SUBMOUNTSRemtec’s LED Substrates and Submounts Meet the Growing Challenges for Cost Effective Packaging in Demanding Applications
Metallized substrates and submounts are produced on alumina, AIN and BeO ceramics using PCTF® (Plated Copper on Thick / Thin Film) metallization, AgENIG® (Electroless Nickel and Immersion Gold over Silver) and DBC (Direct Bond Copper). Manufacturing technology and processes enable Remtec to offer economically priced LED substrates without any compromise in quality or performance.
Remtec’s high performance ceramics offer 25-125µm thick copper metallization. Tin, nickel and gold finish over bare copper allows utilization of various interconnect techniques: RoHS soldering, gold and aluminum wire bond, epoxy and high-temperature die attach as well as flip chip bonding.
In addition, lower cost gold-tin plating can be selectively applied over basic metallization with a protective cap layer that prevents oxidation and ensures void-free solder joints. That, combined with a fine-line capability and gaps as narrow as 50µm, makes Remtec’s submounts an ideal candidate for mounting flip-chip and “bond pad down” GaN, GaAs and other LED devices.
Usage of high thermal conductivity ceramic materials (up to 280 W/MxoC) and thick copper tracks with resistivity less than 1 mΩ/square results in excellent thermal management. Parts can be supplied to a customer in a large multiple-image format for automatic assembly, which reduces the product cost. Otherwise, parts can be supplied individually in waffle packs.
As a result, Remtec is now able to offer LED assembly manufacturers a reliable solution for competitively priced submounts. Low upfront tooling costs and fast turnaround time permit designers to bring their products into market faster and with lower engineering costs.
Remtec, a RoHS compliant, ISO 9001:2008 registered and ITAR compliant company, provides ceramic packaging solutions for optoelectronics, microwave/RF components and modules and DC power electronics. Applications include high performance laser, photo diode and LED submounts, optoelectronic circuits, spacers, power modules as well as RF power amplifiers and TC modules.