Remtec is pleased to announce it has been spotlighted in the popular Fabs and Labs feature of the August, 2024 issue of Microwave Journal. A deep-dive profile of Remtec’s history, specialization, capabilities, and forward-looking focus — the article references the company’s internal theme “The Power of Possible,” which concurrently alludes to the company’s notable strength in the high-power electronics sphere and the company’s considerable potential, given recent investments in a new facility, manufacturing infrastructure, and talent.
Here is a brief excerpt:
“The phrase “The power of possible” appears in Remtec marketing material. It encapsulates the ability to grow and shape the future. As the company celebrates the opening of a newly renovated facility, it is worthwhile to see how Remtec is turning that phrase into reality.
Remtec was founded in 1990 to serve the electronics industry’s growing need for advanced ceramic packaging technology, primarily for applications requiring high power, high circuit density and a broad operating frequency range. The following year, engineers developed Remtec’s proprietary Plated Copper on Thick/Thin Film (PCTF®) ceramic metallization technology that is still central to the company’s product and capabilities portfolio. With that differentiating technology, Remtec established production and manufacturing capabilities to design and fabricate metalized ceramic substrates, surface-mountable hermetic and non-hermetic ceramic packages, chip carriers and specialty components for electronic applications.”
For the complete story, download this PDF or read the article in Microwave Journal here (a subscription is required).