Electronic Design magazine’s Bill Wong interviews Remtec’s Brian Buyea at IMS 2024
We’re pleased to share this story from Electronic Design, featuring an interview with Remtec’s President and CEO, Brian Buyea — conducted by ED’s Senior Content Director, Bill Wong, back at the IEEE/MTT-S International Microwave Symposium (IMS 2024 — June, 16-21, Washington, DC).
Published this week and titled “Ceramic Packaging: When You Really Need Rugged,” the article explores the advantages and applications for thick film and other types of high-performance ceramic circuit, substrate, packaging, and assembly solutions.
Here’s a brief excerpt: “Ceramic packaging and substrates address high-performance and reliability requirements for many electronic applications, especially those found in rugged systems or where consistency and reliability are critical factors. This is particularly apparent in the RF and microwave space. Remtec uses a proprietary technology called plated copper on thick film (PCTF). It can deliver high levels of product uniformity, yield consistency, and reliability.”
Read the complete article and watch the interview here!
Want to put the power of Remtec’s ceramic technology to work in YOUR tough application? Contact us today!