Remtec today announced that Business Development Manager, Chandra Gupta, PhD, will be a presenter for Microwave Journal’s EDI-CON education day (October 23, 11:30 a.m., Eastern) — focused on Radar, Automotive, and Satcom applications.
Gupta’s presentation is titled “Design Guidance Essentials for Thick Film Circuits in RF & Microelectronics Applications.” The presentation will be 20 minutes in length, followed by a 10-minute Q&A period.
Those interested in registering (free of charge) should visit the EDI-CON page here.
Biography of Remtec’s Chandra Gupta, PhD:
Chandra Gupta is the Business Development Manager for Remtec, Inc., where he has been contributing his extensive electronics industry expertise since 2023. With over 35 years of industry experience, Chandra has held significant roles at prominent companies such as Mini-Circuits, Communications & Power Industries, Inc., Analog Devices, Inc. (formerly Hittite Microwave Corp), and Aeroflex (now part of Cobham). His academic background includes a Bachelor of Science and a PhD from the University of Wales in Bangor, United Kingdom, as well as an MBA from Rutgers University. Throughout his career, Chandra has demonstrated a consistent ability to drive business growth and innovation in the technology sector.
Abstract of Gupta’s presentation:
In this presentation, Gupta will delve into key design principles and best practices for developing robust thick film circuits. These circuits — whether configured as single substrates, complex assemblies, or high-density multilayer solutions – can be pivotal assets in applications where performance, reliability and cost are paramount. This presentation will cover:
- design considerations and practical implementations in thick film ceramic boards, such as Alumina, Aluminum Nitride and Beryllium Oxide
- incorporation of resistors, RF hybrids, filters and other structures
- critical challenges posed by the environmental conditions at the board level and provide insights that help ensure performance and durability
- finally, we will emphasize the importance of achieving high repeatability and consistency in the manufacturing process and touch on applicable industry standards
Again, we encourage anyone interested in utilizing a thick film solution for their application to register for this free presentation at the EDI-CON page here.