News & Events

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Here is the latest news, events, and announcements about Remtec’s advanced metallization technologies and products.

Remtec publishes new Direct Bond Copper and Active Metal Braze datasheet

Remtec has issued a new datasheet summarizing the company’s innovative Direct Bond Copper (DBC) and Active Metal Braze (AMB) capabilities, which are well-suited to high-power applications.

Remtec issues new Thick Film Substrates datasheet

Remtec issues a new thick film substrates datasheet in concert with its participation in IMS 2024 in Washington, DC.

Remtec Holds Ribbon Cutting for Its Newly Renovated 55,000 Sq. Ft., $12+ Million Facility In Canton, MA

With an investment of more than $12 million in the project and quadrupling its footprint relative to the company’s previous factory in Norwood, MA — Remtec now offers increased capacity, new manufacturing and process capabilities, increased vertical integration, and a way to return some of the offshore electronics supply chain to the U.S.

See Remtec at IMS 2024 – booth 2215!

Visit Remtec IMS 2024 — booth 2215!

Remtec has served RF/microwave customers for 35 years. Now,with our new, state-of-the-art facility, we’re better equipped than ever to handle your screen printing, etching, plating, and other ceramic production.

Remtec Announces Completion and Transition to its new 55,000 sq. ft., $12+ million facility in Canton, MA

Remtec Incorporated — a leading U.S. provider of ceramic-based packaging, assemblies, substrates, and components applied across the electronics industry announced today that, after a year-long construction project, it has completed its new, 55,000 sq. ft. facility in Canton, Massachusetts.