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Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates.
Norwood, MA. March 24, 2017. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond...
Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.
Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal packaging capabilities of parent company, LTI (www.legacytechnologies.com).
Remtec Adds Assembly Capability On Its Metallized Ceramic Substrates And Packages.
Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF®(Plated Copper on Thick Film) metallization, has significantly expanded its assembly capability on its metallized ceramic substrates and packages.
Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities.
Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities. Norwood, MA, January 19 2015. Remtec Inc.(www.remtec.com), the leading manufacturer of substrates and packages...
Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JEDEC TO-Style Window Lids for Optoelectronic Circuits
Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JEDEC TO-Style Window Lids for Optoelectronic Circuits. Norwood, MA, December 23. 2014. Remtec Inc.,(www.remtec.com) the leading manufacturer of substrates and packages using PCTF® (Plated...
Remtec Expands LED Packaging Capabilities And Adds New Economical Metallization Technologies, Custom Tailored for Specific Customer Requirements
Norwood, MA, November 3, 2014. Remtec Inc., the leading manufacturer of substrates and packages using PCTF® (Plated Copper On Thick / Thin Film) metallization, has expanded its LED substrate and submount design and manufacturing capabilities by adding new features...