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Remtec enlists NWN, Inc. to assist with M&RF clients in Northern California & Northern Nevada
Remtec today announced it has allied with NWN, Inc. of San Jose, California to develop and maintain business opportunities on the West Coast, with a focus on the microwaves and RF sector. A well-regarded and respected manufacturers' representative firm, NWN, Inc. was...
Remtec shares intro slidedeck for IMS 2023
In conjunction with Remtec's participation at the International Microwave Symposium (IMS) 2023 exposition in San Diego, CA (June 13-15), we are pleased to share this introductory slidedeck -- summarizing our capabilities, value, and product offering as it relates to...
IEEE IMS International Microwave Symposium 2023
IEEE IMS International Microwave Symposium 2019
Booth 237
June 4-6
Boston Convention Center
Boston, MA
APEC 2023
APEC 2019
Booth 235
March 18-20
Anaheim Convention Center
Anaheim, CA
SPIE Photonics West 2023
SPIE Photonics West 2019
Booth 5570
February 5-7
Moscone Convention Center
San Francisco, CA
Remtec Introduces High Definition Etchable Thick Film (HDTF) Gold Process on Ceramic
Norwood, MA. February 15, 2018. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has commercialized etchable gold thick film process for High Definition Thick...
Remtec Adds Gold Tin Plated Ceramic Combo Lids to Complement its Ceramic SMT Packages
Norwood, MA. May 12, 2017. RemtecInc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submountsusing PCTF®(Plated Copper on Thick Film) metallization, has added gold tin plated Ceramic Combo Lids to its line of ceramic SMT packages. Now...
Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates.
Norwood, MA. March 24, 2017. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond...
Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.
Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal packaging capabilities of parent company, LTI (www.legacytechnologies.com).
Remtec Adds Assembly Capability On Its Metallized Ceramic Substrates And Packages.
Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF®(Plated Copper on Thick Film) metallization, has significantly expanded its assembly capability on its metallized ceramic substrates and packages.