Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates.

power-transfer-dbc-substratesNorwood, MA. March 24, 2017. Remtec Inc. ( the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond Copper (DBC) substrates. Now circuit designers are able to interconnect both sides of DBC substrates with either PTV® copper plugged vias or copper coated through-holes.

Remtec’s new PTV® vias adapted for direct bond substrates benefit from the well-known quality of curamik® DBC ceramics coupled with Remtec’s innovative copper via plugging and plating process. The added values of Remtec’s new DBC alumina and Aluminum Nitride ceramics with PTV® vias are higher connectivity and circuit density as well as a high current carrying capacity.

Remtec’s new Power Transfer Vias for DBC substrates are hermetic to 10-8 and have a low dc resistance of 1-5 milliohm per via depending on a via size and ceramic thickness. Combining a number of vias into an array allows running currents in excess of 50 AMP. These newly developed DBC substrates with vias can withstand a wide temperature range required for all common assembly methods such as SMT reflow solder, gold tin, gold germanium and Cu-Sil brazing.

Adapting PTV® vias for DBC technology allowed Remtec to significantly expand its product offering for applications requiring higher power and integration levels with space limitations and a need for wire feed-through, installation of pins or terminal headers, high current low resistance and top-to-bottom interconnects.

Remtec’s Power Transfer Vias with DBC substrates are used in high power and current electronic assemblies with efficient heat removal in commercial, industrial and military / space markets. Typical examples include power packages, Light Emitting Diode (LED) devices, laser diode assemblies, hybrid circuits and other high reliability applications requiring high power and high current carrying capacity substrates.

Remtec, a RoHS compliant, ISO 90001:2008 registered and ITAR compliant company, operates a manufacturing facility (totaling 33,000 sq. ft.) in Norwood, MA. Remtec produces custom and semi-custom packaging solutions for sensors and detectors, RF/MW products, DC power electronics, optoelectronics and other high density and power circuitry in commercial, industrial and military industries.


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