Innovative Technology, Versatile Products

Our Products

Remtec is a leading provider of thin film, thick film, and direct bond copper substrates and packaging products for the electronics industry.

Our advanced ceramic packaging technology—Plated Copper Thick Film (PCTF®)—combines standard thick films with copper plating, advanced materials, and proprietary manufacturing processes to create innovative, cost-effective solutions for electronics applications involving high power, heavy circuit density, and rigorous environmental conditions.

From our US-based manufacturing facility, Remtec designs and fabricates a versatile range of metallized products utilizing PCTF® technology. From metallized ceramic substrates and chip carriers to hermetic and non-hermetic ceramic SMT packages and other specialty components, we can offer a solution not readily achievable with either conventional thin or thick films, or co‐fired ceramics.

Remtec is an ISO 9001:2015 certified, RoHS and ITAR compliant company. Our sales and applications engineering teams deliver rapid responsiveness, short lead-times, and problem-solving support to a diverse customer base.

Remtec serves a broad range of customers, including telecommunications, healthcare, military, avionics, space, and commercial industries. Typical applications include:

  • Optoelectronics
  • Microwave circuitry
  • Laser instrumentation systems
  • Medical electronics
  • RF power amplifiers and LNAs
  • Optical switches
  • Laser and photo diode submounts
  • LEDs, sensors, and filters
  • High‐density DC/DC converters
  • Driver circuits
  • Thermoelectric coolers
  • Power assemblies, modules, and hybrids
  • Interposers
  • Flip chip carriers

Our Technology

Remtec Delivers High-Performance Metallized Products for Superior Results

Remtec’s high-quality engineering and patented manufacturing processes enable us to create metallized packaging solutions designed to any specification, resulting in products with more uniformity, more consistent yield, greater reliability, and higher performance results. The benefits speak for themselves.
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Higher Current Carrying Capacity

Remtec products utilize plated copper metallization on thermally-conductive ceramic to provide current capacity in excess of 50 amps.
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Improved Thermal Management

Plated copper metallization on Alumina, ALN, and BeO substrates (up to 0.010”) provides excellent heat spreading and low thermal resistance, making them ideal thermal management solutions.
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Innovative Ceramic Packages

Remtec leads the industry in the design and fabrication of advanced metallized ceramic solutions for SMT attachment, including leadless hermetic and non-hermetic packages, flip chip carriers, and interposers.

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Increased Circuit Density

Remtec’s PCTF® technology combines fine lines (50 µm) and thick copper plated “wires” to significantly increase the density of circuits contained within a miniaturized package.

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Wider Frequency Range

Successfully field‐tested to frequencies up to mm range with low losses, Remtec’s metallized ceramic substrates can replace costly thin film circuits without sacrificing performance.

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High Assembly Yield

Remtec’s metallized substrates, chip carriers and packages withstand multiple soldering operations, assure excellent solderability, exhibit no solder leaching, and are suitable for a wide range of interconnect techniques.

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More Reliable Products

Remtec’s fully‐assembled metallized ceramic substrates are qualified to withstand the extreme environments required for space (Class H and K), military, and biomedical applications without the loss of adhesion, via integrity, and hermeticity.

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Value-Added Features

In addition to our copper-plated metallization technology, Remtec offers other features such as plated through holes, solid plugged metal vias, castellations, and integrated, wide-range thick film resistors and multilayers.

Remtec Products

Remtec’s thick film, and direct bond copper (DBC) products utilize our proprietary Plated Copper Thick Film (PCTF®) technology to achieve results you won’t find with conventional thin or thick films, or co‐fired ceramics. We even custom-engineer solutions designed to your exact specifications.
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Laser & Photodiode Submounts

High-performance, cost-effective submounts, accessory circuits, and spacers manufactured to exact specifications.

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LED Substrates & Submounts

Metallized substrates and submounts deliver economical packaging solutions for the most demanding applications.

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Leadless Hermetic & Non-Hermetic SMT Packages

Surface-mount technologies are a cost-effective alternative to standard TO-style packages for optoelectronics, offering optimal reliability and high-performance features, at a lower cost and faster time-to-market.

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Leadless Ceramic SMT Substrates & Interposers

Substrates, chip carriers, and packages, designed and manufactured for direct mounting of components and multichip modules.

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Low-Cost AgENIG Substrates

Innovative substrates provide RoHS compliance without expensive platinum and palladium films.

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Metallized Ceramic Sensors

Superior protection for delicate sensor and detector components operating in harsh environmental conditions.

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High-Density Thick Film Substrates

Thick film ceramic circuits are precision-engineered for cost versatility, reliable performance, and flexible design options.

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DBC and AMB Substrates

DBC substrates feature excellent solderability, better thermal conductivity, and higher current capacity—at a lower cost.

Process + Plating Capabilities

Remtec also offers a broad range of custom manufacturing and metal plating services, engineered to your exact specifications.

Process Capabilities
  • Thick film on alumina, aluminum nitride, beryllia, barium titanate, zirconia, quartz, and glass with automated magazine-to-magazine print and fire
  • Direct-bond copper (DBC) on alumina, aluminum nitride and military-grade ceramic
  • Active Metal Braze (AMB) on Silicon Nitride
  • Single- and double-sided copper (from 0.001” to 0.016” thick)
  • Complete engineering, design, and application support
  • Prototype-to-volume production
  • Rapid technical support response with fast turnaround
Specialty Plating
  • Copper (electrolytic)
  • Gold (electroless, immersion, and electrolytic)
  • Nickel (electroless and electrolytic)
  • Tin (electrolytic (acid))
  • Gold-Tin alloy
  • Silver
  • Palladium
  • Selective deposit patterning
Solder Stop
  • Dry film
  • Liquid photo imageable for high resolution
  • LED-specific brilliant white
  • High temperature
  • Laser ablation
  • Selective nickel barrier
Ceramic Cutting Options
  • Laser machining contours
  • Laser drilling
  • Laser scribing
  • Laser marking
  • Diamond saw/dicing
  • Zero Pullback® metallization
Specialty Processing
  • Solid metal vias (copper, silver, or gold in both hermetic and non-hermetic styles)
  • Plated through holes, bore coating, wraparounds, and castellations
  • Stand-offs for SMT attachment
  • Fine-line precision etching
  • Integrated printed resistors in wide range
  • High-speed, precision, automatic laser trim and test
  • Lapping and polishing copper
  • Pin and lead-off attachment
  • Tape and reel packaging
Quality Assurance Inspection & Testing
  • ISO 9001:2015-certified
  • Based on selected methods from MIL-STD-883 and MIL-STD-750
  • SPC implemented at critical process operations
  • 100% inspection in critical applications
  • Zero-based acceptance sampling in accordance with ANSI/ASQ Z1.4 procedures
  • Broad testing capabilities: electrical, mechanical, adhesion, environmental, and functional


We’re Ready to Help You.

Remtec’s team of technical experts will assist you with your metallized ceramic requirements. We provide a complete solution—from prototype design and fabrication to high volume production.

Please send your electronic files in DXF and/or DWG formats to Additional design guidelines are available upon request.