Low-Cost AgENIG Substrates
Remtec Product
A Cost-Effective Substitute for Platinum and Palladium Substrates
Remtec engineers have developed a proprietary process for manufacturing metallized ceramic substrates that are not only RoHS compliant, but also a cost-effective substitute for expensive thick film materials containing platinum and palladium.
Lower-cost AgENIG® metallized ceramic substrates combine silver thick film processing with electroless nickel and immersion gold plating, and are 30% lower in price than commonly-used Pd-Pt-Ag substrates.
Typical applications include miniature DC/DC converters, RF resonators and filters, and TEC substrates.
Features
- Significantly-reduced solder leaching over conventional thick film substrates.
- Plated substrates ensure more reliable solder connections, and can withstand multiple SMT reflow solder cycles and repairs.
- Track resistivity improved tenfold to 1m/square.
- Substrates can be used up to 170ºC continuous operation temperature.
- Pattern definition can be held to 0.006” line and spaces.
- Versatile surface finishes for different assembly types.
- Available with all the major features of Remtec’s Plated Copper on Thick Film (PCTF®) technology, including multilayers, integrated resistors, plugged via holes, and plated through holes.
Contact
We’re Ready to Help You.
Remtec’s team of technical experts will assist you with your metallized ceramic requirements. We provide a complete solution—from prototype design and fabrication to high volume production.
Please send your electronic files in DXF and/or DWG formats to sales@remtec.com. Additional design guidelines are available upon request.