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Microwave Journal

Microwave Journal

by remtec1 | Jun 1, 2008

GAN Two-Stage 10W Hybrid Transmitter Power Amplifier Modules

PCTF® Approach Saves MW/RF Component/Module Costs

PCTF® Approach Saves MW/RF Component/Module Costs

by remtec1 | Mar 1, 2007

The Development of an Advanced Hermetic Power Package for Solid State Power Controller

The Development of an Advanced Hermetic Power Package for Solid State Power Controller

by remtec1 | Aug 1, 2000

News & Events

  • IEEE IMS International Microwave Symposium 2019 January 4, 2019
  • APEC 2019 January 4, 2019
  • SPIE Photonics West 2019 January 4, 2019
  • Remtec Introduces High Definition Etchable Thick Film (HDTF) Gold Process on Ceramic April 6, 2018
  • Remtec Adds Gold Tin Plated Ceramic Combo Lids to Complement its Ceramic SMT Packages June 7, 2017

About Us

Remtec is dedicated to using its wide range of ceramic metallization and packaging technologies as well as its wide-ranging equipment base, modern manufacturing techniques and diverse industry experience to solve your electronic packaging problems. Utilizing the latest CAD tools, Remtec engineers work closely with you to develop the most cost-effective manufacturing techniques for your specific requirements.

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Phone: 781.762.9191
Fax: 781.762.9777
Email:sales@remtec.com

Address:
100 Morse Street
Norwood, MA 02062
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Latest News

  • IEEE IMS International Microwave Symposium 2019 January 4, 2019
  • APEC 2019 January 4, 2019
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