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PR27 Remtec Expands DBC Substrate Capabilities

by remtec1 | May 24, 2014 | 0 comments

PR27 Remtec Expands DBC Substrate Capabilities

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  • IEEE IMS International Microwave Symposium 2019 January 4, 2019
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  • SPIE Photonics West 2019 January 4, 2019
  • Remtec Introduces High Definition Etchable Thick Film (HDTF) Gold Process on Ceramic April 6, 2018
  • Remtec Adds Gold Tin Plated Ceramic Combo Lids to Complement its Ceramic SMT Packages June 7, 2017

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Remtec is dedicated to using its wide range of ceramic metallization and packaging technologies as well as its wide-ranging equipment base, modern manufacturing techniques and diverse industry experience to solve your electronic packaging problems. Utilizing the latest CAD tools, Remtec engineers work closely with you to develop the most cost-effective manufacturing techniques for your specific requirements.

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  • IEEE IMS International Microwave Symposium 2019 January 4, 2019
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