Products & Services

Remtec Uses PCTF and Other Advanced Technologies to Design and Produce Cost-Effective Custom and Semi-Custom Packaging Solutions—Metallized Substrates, Packages and Components—for DC Power Electronics, Optoelectronics and RF/MW Applications in Commercial, Industrial and Military Industries.

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Laser and Photodiode Submounts

  • Plated Copper on Thick Film & Thin Films on ALN and BeO
  • Zero pull back metallization
  • Economical selective AuSn plating
  • Three-sided metallization wire bondable and solderable

Leadless Hermetic SMT Packages

  • Leadless Hermetic packages meet MIL-STD-883
  • Suitable for direct PCB mount for RF / microwave and high DC power components, flip chips and modules
  • Plated copper on Thick Film metallization with wraparounds
  • Solid via holes: signal, ground and carry high current
  • Low Thermal Resistance – Excellent thermal management

 

Direct Bond Copper Substrates

  • Fast turnaround DBC products on Alumina and ALN
  • Prototype to production volumes
  • Higher conductivity, high current capacity and heat dissipation
  • Excellent solderability & wire bondability
  • Fine Line resolution and step etching

LED Submounts

  • Plated Copper on Thick Film & Thin Films
  • ENIG finish over thick film silver and DBC
  • Board materials: Alumina, AlN and BeO
  • Selective AuSn plating when needed

Low Cost AgENIG® Substrates

  • Cost effective, reliable RoHS compliant
  • ENIG finish on Thick Film (AgENIG®)
  • Replaces costly Pd-Pt-Ag materials
  • Zero Solder leaching, low DC resistance
  • High Continuous operating temperature

Specialty Plating

  • Cost Effective fast turnaround
  • Copper, Tin, Nickel, Gold
  • Specialty: AuSn plating on ceramic, wafers, etc.
  • In house analytic laboratory

 

Leadless Ceramic SMT Substrates & Interposers

  • Ready-made carriers for direct PCB mount for single die and multi-chip devices
  • Plated copper on Thick Film metallization with wraparounds
  • Solid via holes: single ground, Power Transfer Via (PTV)
  • Ceramic interposers for flip chip devices & interconnecting materials with dissimilar TCE

High Density Thick Film Substrates

  • Cost effective, high performance Thick Film Multilayers
  • 6-8 conductor layers, hermetic plugged vias, printed resistors
  • Etched Thick Films with 0.002” min. line/space & 0.00025” line/gap tolerance
  • Plated circuits are compatible with RoHS compliant SAC solders

Specialty Processing

  • Plated and boar coated through holes
  • Solid filled vias & Castellations
  • Lead-off attachment & Integrated connectors
  • Pin, housing & bushing attachment
  • Lapping & Polishing
  • High temperature solder & braze assembly

Laser & Photo Diode Ceramic Submounts

  • Plated Copper on Thick Film & Thin Films on ALN and BeO
  • Zero pullback metallization
  • Economical selective AuSn plating
  • Three-sided metallization: wire bondable and solderable

Leadless Ceramic SMT Substrates and Interposers

  • Ready-made carriers for direct PCB mount for single die and multi-chip devices
  • Plated copper on Thick Film metallization with wraparounds
  • Solid via holes: signal, ground, thermal pipes
  • Ceramic interposers for flip chip devices & interconnecting materials with dissimilar TCE

Low Cost AgENIG Substrates

  • Cost effective, reliable RoHS compliant
  • ENIG finish on thick film (AgENIG)
  • Replaces costly Pd-Pt-Ag materials
  • Zero Solder leaching, low DC resistance
  • High Continuous operating temperature

Direct Bond Copper Substrates (DBC)

  • Fast turnaround DBC products on alumina and AlN
  • High thermal conductivity, high current capacity and heat dissipation
  • Excellent solderability & capability to withstand multiple solder operations

LED Submounts & Substrates

  • Plated Copper on Thick Film & Thin Films
  • ENIG finish over thick film silver, DBC
  • Board materials: alumina, AlN and BeO
  • Selective AuSn plating when needed.

Leadless Hermetic SMT Packages

  • Leadless Hermetic packages meet Mil Std 883
  • Suitable for direct PCB mount for RF /microwave and high DC power  components, flip chips  and modules
  • Plated copper on Thick Film metallization with wraparounds
  • Solid via holes: signal, ground, and carry  high current
  • Low Thermal resistance – Excellent Thermal management

High Density Thick Film Substrates

  • Cost effective, high performance thick film multilayers
  • 6-8 conductor layers,  hermetic plugged vias, printed resistors
  • Etched thick films with 0.002 in min line space & 1.00025 in line gap tolerance
  • Plated circuits are compatible with RoHS compliant SAC solders

Plating Services

  • Cost Effective $ fast turn around
  • Cu, Tin, Nickel, Gold
  • Specialty: AuSn plating on ceramic, wafers  ,etc.
  • In house analytic laboratory

See Our Process Capabilities

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Get Design Help

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Metallized Ceramic Substrate

Specialty Products

Advanced Thick Film

Printed Resistors & Plated Thru Holes

PCTF & Thinfilm

Attachment Solutions & Final Finish

PCTF & Thickfilm

Castellation Plugged Via Bumps

Remtec is dedicated to using its wide-ranging equipment base, modern manufacturing techniques and diverse industry experience to solve your microelectronic packaging problems. Our technical personnel are well prepared to use their broad materials expertise to meet your packaging and assembly needs. Utilizing the latest CAD tools, Remtec engineers work closely with you to develop the most cost-effective manufacturing techniques for your specific requirements.

Have Questions? Get in Touch!

If you are interested in Remtec and the services and technology we provide, send us an inquiry and we will get back to you as soon as possible!

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