Home
Company
Products & Services
Technology
News
- Press Releases
Resources
- Technical Papers
- Data Sheets
Contact
- Representatives

8427Legacy

PR38 Remtec Adds Assembly Capability On Its Metallized Ceramic Substrates And Packages

by remtec1 | Mar 14, 2016 | 0 comments

Search for:

News & Events

IEEE IMS International Microwave Symposium 2019 January 4, 2019
APEC 2019 January 4, 2019
SPIE Photonics West 2019 January 4, 2019
Remtec Introduces High Definition Etchable Thick Film (HDTF) Gold Process on Ceramic April 6, 2018
Remtec Adds Gold Tin Plated Ceramic Combo Lids to Complement its Ceramic SMT Packages June 7, 2017

About Us

Remtec is dedicated to using its wide range of ceramic metallization and packaging technologies as well as its wide-ranging equipment base, modern manufacturing techniques and diverse industry experience to solve your electronic packaging problems. Utilizing the latest CAD tools, Remtec engineers work closely with you to develop the most cost-effective manufacturing techniques for your specific requirements.

Contact Us

Phone: 781.762.9191
Fax: 781.762.9777
Email:sales@remtec.com

Address:
100 Morse Street
Norwood, MA 02062
USA

Menu

Home
About Us
Technology
FAQ’s
News
Contact

Latest News

IEEE IMS International Microwave Symposium 2019 January 4, 2019
APEC 2019 January 4, 2019

© 2021 Remtec, Inc. All Rights Reserved. Design by GruffyGoat