The following links contain technical information and specifications for Remtec products. These resources are intended to help manufacturing engineers and designers incorporate Remtec’s innovative and cost-effective metallization technologies into your products.
Remtec - MW RF PCTF
Remtec APEC Paper Presentation
RFHIC MWJ Paper GaN 10W PA
Laser and Photo Diode Submounts
Direct Bond Copper Substrates
Leadless Ceramic SMT Substrates, Packages & Components
Leadless Hermetic Ceramic SMT Substrates & Packages
Low Cost AgENIG Thick Film Substrates
Multilayer Thick Film Substrates
Metallized Substrates, Packages & Components with PCTF Technology
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Remtec’s team of technical experts will assist you with your metallized ceramic requirements. We provide a complete solution—from prototype design and fabrication to high volume production.
Please send your electronic files in DXF and/or DWG formats to email@example.com. Additional design guidelines are available upon request.