Remtec Specs

The following links contain technical information and specifications for Remtec products. These resources are intended to help manufacturing engineers and designers incorporate Remtec’s innovative and cost-effective metallization technologies into your products.

Technical Papers

%title - rem 394

Remtec - MW RF PCTF

%title - rem dg8wq0

Remtec APEC Paper Presentation

%title - rem 7f81332


%title - rem sfs8


Data Sheets

%title - rem f782

Laser and Photo Diode Submounts

%title - rem 92002

Specialty Plating

%title - rem 839df

Direct Bond Copper Substrates

%title - rem 939924

Leadless Ceramic SMT Substrates, Packages & Components

%title - technologist with grey tablet his hands make set up production line while standing

Leadless Hermetic Ceramic SMT Substrates & Packages

%title - rem f892

Low Cost AgENIG Thick Film Substrates

%title - rem 8920fg

Multilayer Thick Film Substrates

%title - rem 27842fg

Metallized Substrates, Packages & Components with PCTF Technology

For additional details, contact your Remtec representative.


We’re Ready to Help You.

Remtec’s team of technical experts will assist you with your metallized ceramic requirements. We provide a complete solution—from prototype design and fabrication to high volume production.

Please send your electronic files in DXF and/or DWG formats to Additional design guidelines are available upon request.