Resources
Remtec Specs
The following links contain technical information and specifications for Remtec products. These resources are intended to help manufacturing engineers and designers incorporate Remtec’s innovative and cost-effective metallization technologies into your products.
Technical Papers
Remtec - MW RF PCTF
Remtec APEC Paper Presentation
RFHIC MWJ Paper GaN 10W PA
Teledyne
Data Sheets
Laser and Photo Diode Submounts
LED Substrated & Submounts
DBC and AMB Substrates
Leadless Ceramic SMT Substrates and Interposers
Leadless Hermetic and Non-hermetic SMT Packages
Low-Cost AgENIG Substrates
High-Density Thick Film Substrates
Metallized Ceramic Sensors
For additional details, contact your Remtec representative.
Contact
We’re Ready to Help You.
Remtec’s team of technical experts will assist you with your metallized ceramic requirements. We provide a complete solution—from prototype design and fabrication to high volume production.
Please send your electronic files in DXF and/or DWG formats to sales@remtec.com. Additional design guidelines are available upon request.