Resources
Remtec Specs
The following links contain technical information and specifications for Remtec products. These resources are intended to help manufacturing engineers and designers incorporate Remtec’s innovative and cost-effective metallization technologies into your products.
Technical Papers
Remtec - MW RF PCTF
Remtec APEC Paper Presentation
RFHIC MWJ Paper GaN 10W PA
Teledyne
Data Sheets
Laser and Photo Diode Submounts
Specialty Plating
Direct Bond Copper Substrates
Leadless Ceramic SMT Substrates, Packages & Components
Leadless Hermetic Ceramic SMT Substrates & Packages
Low Cost AgENIGtm Thick Film Substrates
Multilayer Thick Film Substrates
Metallized Substrates, Packages & Components with PCTF Technology
For additional details, contact your Remtec representative.
Contact
We’re Ready to Help You.
Remtec’s team of technical experts will assist you with your metallized ceramic requirements. We provide a complete solution—from prototype design and fabrication to high volume production.
Please send your electronic files in DXF and/or DWG formats to sales@remtec.com. Additional design guidelines are available upon request.