Resources
Remtec Specs
The following links contain technical information and specifications for Remtec products. These resources are intended to help manufacturing engineers and designers incorporate Remtec’s innovative and cost-effective metallization technologies into your products.
Technical Papers

Remtec - MW RF PCTF

Remtec APEC Paper Presentation

RFHIC MWJ Paper GaN 10W PA

Teledyne
Data Sheets

Laser and Photo Diode Submounts

Specialty Plating

Direct Bond Copper Substrates

Leadless Ceramic SMT Substrates, Packages & Components

Leadless Hermetic Ceramic SMT Substrates & Packages

Low Cost AgENIGtm Thick Film Substrates

Multilayer Thick Film Substrates

Metallized Substrates, Packages & Components with PCTF Technology
For additional details, contact your Remtec representative.
Contact
We’re Ready to Help You.
Remtec’s team of technical experts will assist you with your metallized ceramic requirements. We provide a complete solution—from prototype design and fabrication to high volume production.
Please send your electronic files in DXF and/or DWG formats to sales@remtec.com. Additional design guidelines are available upon request.