Technology

Thermal management improvement:
Using plated copper metalization from .001” to .010” thick, on a thermally conductive base as thin as .010”, with thermal vias (K=200W/°CxM), plated through holes and plated-up heat spreaders and low thermal resistance (Øjc below 2°C/W), designers can achieve a degree of heat dissipation not previously possible at the commercial level.

Designers can increase circuit density in a miniaturized package:
Using Remtec’s PCTF^® technology, designers can combine fine lines (.002”) and thick copper plated wires (.010” in diameter). In addition, thick film multi-layer patterns (up to four layers per side), small size printed thick film resistors (smaller than .010” X .010”) and inductors contribute to maximum performance in a miniaturized package.

PCTF ^® circuitry operates at a wide frequency range:
Remtec’s metalized ceramic substrates have been successfully field-tested to frequencies exceeding 24 GHz with low losses, often replacing costly thin filmcircuits without sacrificing performance. PCTF technology incorporates microstrip lines, fine lines, resistors and efficient signal and ground connections.

PCTF ^® circuitry assures high assembly yield:
Remtec’s metalized substrates, chip carriers and packages are compatible with advanced electronic assembly techniques. Our substrates withstand multiple soldering operations, assure excellent solderability, exhibit no solder leaching and are suitable for various interconnect techniques: SMT, gold and aluminum wire bond, epoxy die-bond, flip chip technology and high temperature die-attach.

PCTF ^® circuitry performs reliably in harsh environments:.
Remtec’s metalized ceramic substrates (fully-assembled) withstand thermal cycling from -65^oC to 150^oC (more than 1000 cycles), and can operate at elevated temperatures up to 200^oC. In addition, Remtec’s substrates have qualified for space (Class H & K), military and biomedical applications. Remtec’s products have also demonstrated superior adhesion, as well as via integrity and hermeticity.