Process Capabilities
Thick Film on Alumina, Aluminum Nitride, Beryllia, Barium Titanate, Zirconia, Quartz and Glass with Automated magazine-to-magazine print & fire- Direct Bond Copper on Alumina, Aluminum Nitride and military grade ceramic
- Single and double sided copper from .001” to .016” thick
- Rapid response with Fast turn around
- Prototype to volume production
- Complete Engineering, Design, and Application support
Specialty Plating
- Copper – Electrolytic on thick and thin films
- Gold –Electroless, Immersion, and Electrolytic
- Nickel –Electroless and Electrolytic
- Tin – Electrolytic (acid)
- Gold/Tin Alloy
- Selective deposit patterning
Solder Stop
- Dry Film
- Liquid Photo Imageable for high resolution
- LED specific Brilliant White
- High Temperature
- Laser ablation
- Selective Nickel barrier
Ceramic Cutting Options
- Laser machining contours
- Laser drilling
- Laser scribing
- Laser marking
- Diamond Saw/Dicing
- Zero Pullback® Metallization
Specialty Processing
- Solid metal via technology, Au, Ag and Cu both hermetic and non-hermetic vias
- Plated through holes, bore coating, wraparounds and castellations
- Stand-offs for SMT attachment
- Fine line precision etching
- Integrated printed resistors in wide range
- High Speed Precision automatic Laser Trim and Test
- Lapping and polishing copper
- Pin and Lead-off attachment
- Tape & Reel packaging
Quality Assurance Inspection and Testing
- ISO 9001:2008 Certified
- Based on selected methods from MIL-STD-883 and MIL-STD-750
- SPC implemented at critical process operations
- 100% Inspection in critical applications
- Zero Based Acceptance Sampling and Sampling IAW ANSI/ASQ Z1.4 are used
- Broad Test capabilities: electrical, mechanical, adhesion, environmental and functional
- Thick Film (Au, Ag, Cu) Precision Screen printing and sintering on Alumina, AlN, Beryllia, Barium Titanate, Zirconia, Quartz and Glass.
- Up to 12×12” substrate format
- Automated cassette-to-cassette print & fire
- Solid metal via technology, Au and Ag (hermetic vias)
- Through hole metallized via holes, wraparounds and castellations
- Integrated printed resistors in wide range on Alumina, AlN, Beryllia
- High Speed Precision automatic Laser Trim and Test
- Thick and Thin Films precision etching
- Polymer Thick film processing
- DBC processing
- LPI and Dry film solder mask
- Heat and UV material curing
- Electrolytic copper plating on thick and thin films with the following finish
- Tin plating up to .002” thick
- Electrolytic and Electroless nickel and gold plating
- Selective Gold Tin Plating
- Broad Equipment Base (see, cross reference to manufacturing capabilities)
- Quality Assurance System based on MIL-STD-750 and MIL-STD-883; SPC and AQL sampling, 100% in critical applications
- Class 100K clean room (10K in selected areas)
- In house machine shop for production and test fixtures fabrication
- Broad Test capabilities: electrical, mechanical, adhesion, environmental and functional