Remtec’s new thick film substrates datasheet
Remtec has issued a new datasheet that summarizes the company’s advanced and unique custom thick film substrates capabilities. The sheet has been released in conjunction with Remtec’s participation in the IMS 2024 expo to be held in Washington, DC from June 16-21 at booth 2215. Here is a brief excerpt from the new document:
“An attractive alternative to thin film solutions, Remtec manufactures cost-effective, high-performance thick film single layer and multilayer ceramic circuits with 6-8 conductor layers, ground planes, hermetic plugged and plated vias (e.g., interlayer blind, partial through, or power/thermal vias) – as well as printed resistors on Alumina, Aluminum Nitride, Beryllia, Silicon Nitride, and other ceramics. Products include both traditional gold multilayer thick films with excellent wire bondability, solderability, and conductor adhesion – and lower-cost multilayer circuits utilizing silver interlayer conductors and plated copper on thick films with higher conductivity of 1-3 mΩ/sq.”
To read and/or download the complete datasheet, which includes complete specifications, tolerances, and more — click here.
To initiate a conversation with a Remtec thick film expert and applications expert, email sales@remtec.com.