REMTEC… Your One Stop Provider for Ceramic Packaging Solutions

Remtec Uses PCTF® and Other Advanced Technologies to Design and Produce Cost-Effective Custom and Semi-Custom Packaging Solutions—Metallized Substrates, Packages and Components—for Power Electronics, Optoelectronics and RF/MW Applications in Commercial, Industrial and Military Industries.

News & Events

Remtec Introduces High Definition Etchable Thick Film (HDTF) Gold Process on Ceramic

Remetec has commercialized etchable gold thick film process for High Definition Thick Film (HDTF) circuitry as a low-cost alternative to thin films [read more]

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