PCTF Plated copper Thick Films
Laser & Photodiode Submounts
Leadless Hermetic SMT Packages
Low Cost AgENIG® Substrates
High Density Thick Film Substrates
REMTEC… Your One Stop Provider for Ceramic Packaging Solutions
Remtec Uses PCTF® and Other Advanced Technologies to Design and Produce Cost-Effective Custom and Semi-Custom Packaging Solutions—Metallized Substrates, Packages and Components—for Power Electronics, Optoelectronics and RF/MW Applications in Commercial, Industrial and Military Industries.
News & Events
Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.
Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal packaging capabilities of parent company, LTI (www.legacytechnologies.com).
Remtec will be at Booth 333
Click here for more information.
Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF®(Plated Copper on Thick Film) metallization, has significantly expanded its assembly capability on its metallized ceramic substrates and packages.
Booth 4315. Click here for more information.