PCTF® Technology & Products
Laser & Photodiode Submounts
Leadless Hermetic SMT Packages
Low Cost AgENIG® Substrates
High Density Thick Film Substrates
REMTEC… Your One Stop Provider for Ceramic Packaging Solutions
Remtec Uses PCTF® and Other Advanced Technologies to Design and Produce Cost-Effective Custom and Semi-Custom Packaging Solutions—Metallized Substrates, Packages and Components—for Power Electronics, Optoelectronics and RF/MW Applications in Commercial, Industrial and Military Industries.
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