REMTEC… Your One Stop Provider for Ceramic Packaging Solutions
Remtec Uses PCTF® and Other Advanced Technologies to Design and Produce Cost-Effective Custom and Semi-Custom Packaging Solutions—Metallized Substrates, Packages and Components—for Power Electronics, Optoelectronics and RF/MW Applications in Commercial, Industrial and Military Industries.
News & Events
Remtec Introduces High Definition Etchable Thick Film (HDTF) Gold Process on Ceramic
Remetec has commercialized etchable gold thick film process for High Definition Thick Film (HDTF) circuitry as a low-cost alternative to thin films [read more]
SPIE Photonics West 2019
SPIE Photonics West 2019
Booth 5570
February 5-7
Moscone Convention Center
San Francisco, CA
IEEE IMS International Microwave Symposium 2019
IEEE IMS International Microwave Symposium 2019
Booth 237
June 4-6
Boston Convention Center
Boston, MA
