REMTEC… Your One Stop Provider for Ceramic Packaging Solutions

Remtec Uses PCTF® and Other Advanced Technologies to Design and Produce Cost-Effective Custom and Semi-Custom Packaging Solutions—Metallized Substrates, Packages and Components—for Power Electronics, Optoelectronics and RF/MW Applications in Commercial, Industrial and Military Industries.

News & Events

Remtec Introduces High Definition Etchable Thick Film (HDTF) Gold Process on Ceramic

Remetec has commercialized etchable gold thick film process for High Definition Thick Film (HDTF) circuitry as a low-cost alternative to thin films [read more]


Continued growth at Remtec provides new opportunities to join our team.

SPIE Photonics West 2019

SPIE Photonics West 2019

Booth 5570

February 5-7

Moscone Convention Center

San Francisco, CA

APEC 2019

APEC 2019

Booth 235

March 18-20

Anaheim Convention Center

Anaheim, CA

IEEE IMS International Microwave Symposium 2019

IEEE IMS International Microwave Symposium 2019

Booth 237

June 4-6

Boston Convention Center

Boston, MA