About Us
Backed by a legacy of quality engineering, Remtec can deliver a creative, cost-effective metallized substrate and packaging solution designed to any specification.
For more than three decades, Remtec has been a premier designer and manufacturer of thick film, direct bond copper substrates and packaging products for the electronics industry. We now lead the industry in specialty metallized applications with our advanced ceramic packaging technology: Plated Copper Thick Film (PCTF®).
Engineered specifically for electronics applications involving high power, heavy circuit density, and rigorous environmental conditions, our proprietary technology plates copper images over thick film on ceramic substrates.
In addition to ceramic substrates, Remtec designs and fabricates a wide range of metallized products utilizing our PCTF® technology, including chip carriers, hermetic and non-hermetic ceramic SMT packages, and other specialty components—all manufactured right here in our US-based facility.
Our patented manufacturing processes enable us to achieve a more uniform product with consistent yield, greater reliability, and higher performance results—every time.
Remtec is ISO 9001:2015 certified, RoHS and ITAR compliant.
Industries We serve
Military
PCTF®, AgENIG® and DBC for radar, flight guidance, navigation and target acquisition systems utilizing heat spreading package solutions for GaN semiconductors and RF & Microwave circuits.
Aerospace
Industrial Electronics
PCTF®, AgENIG® and DBC for laser submounts, and sensing/control functions.
Semiconductor Equipment
PCTF®, AgENIG® and DBC for high power RF Power Generators, high current carrying substrates, low inductance planar coils and precision matched resistors.
Opto Electronics
Medical Instrumentation
PCTF®, and AgENIG® for blood analyzers, dental x-rays, pulse oximeters, electronic surgical devices, implantable sensors, laser aesthetic solutions and scanning applications.
Transportation
DBC, AMB and PCTF® in high power, sensing and control in automotive and rail braking, traction control, charging, and LED lighting.
Commercial Telecom
PCTF® and DBC for high density optical packaging solutions, heat spreaders, RF test & instrumentation, and DC power circuitry where limited space and (SMT) surface mount solutions.
Remtec Products
Remtec offers a full range of thick film and direct bond copper (DBC) products, as well as customized solutions designed to any specification.
Products utilizing our proprietary Plated Copper Thick Film (PCTF®) technology achieve results not found with conventional thick films or co‐fired ceramics. Additionally, Remtec’s proprietary processes for electrolytic copper, nickel, gold, gold-tin, electroless nickel, and AgENiG provide finishes that are wire-bondable and solderable for even more options and flexibility.
Laser & Photodiode Submounts
High-performance, cost-effective submounts, accessory circuits, and spacers manufactured to exact specifications.
LED Substrates & Submounts
Metallized substrates and submounts deliver economical packaging solutions for the most demanding applications.
Leadless Hermetic & Non-Hermetic SMT Packages
Surface-mount technologies are a cost-effective alternative to standard TO-style packages for optoelectronics, offering optimal reliability and high-performance features, at a lower cost and faster time-to-market.
Leadless Ceramic SMT Substrates & Interposers
Substrates, chip carriers, and packages, designed and manufactured for direct mounting of components and multichip modules.
Low-Cost AgENIG Substrates
Innovative substrates provide RoHS compliance without expensive platinum and palladium films.
Metallized Ceramic Sensors
Superior protection for delicate sensor and detector components operating in harsh environmental conditions.
High-Density Thick Film Substrates
Thick film ceramic circuits are precision-engineered for cost versatility, reliable performance, and flexible design options.
DBC and AMB Substrates
DBC substrates feature excellent solderability, better thermal conductivity, and higher current capacity—at a lower cost.
News + Events
Here’s what we’re talking about at Remtec.
Ed Woytaszek Joins Remtec, a Norwood, MA-based Supplier of Ceramic-based Electronics Solutions
Woytaszek will head up product line management and business development efforts focused on the company’s microwaves & RF customer segment Norwood, MA -- Remtec Incorporated -- a leading U.S. provider of ceramic-based packaging, assemblies, substrates, and...
Leading ceramic-based electronics manufacturer, Remtec, names Brian Buyea as president
Norwood, MA -- Remtec Incorporated -- a leading U.S. provider of ceramic-based packaging, assemblies, substrates, and components widely applied across the electronics industry – announced today that its board of directors has named Brian Buyea president of the...
Remtec shares time-lapse video of new Canton, MA facility construction in progress
Remtec is pleased to share this brief time-lapse footage of the progress being made at our new Canton, MA facility: Construction permit...
Remtec enlists NWN, Inc. to assist with M&RF clients in Northern California & Northern Nevada
Remtec today announced it has allied with NWN, Inc. of San Jose, California to develop and maintain business opportunities on the West Coast, with a focus on the microwaves and RF sector. A well-regarded and respected manufacturers' representative firm, NWN, Inc. was...
Remtec shares intro slidedeck for IMS 2023
In conjunction with Remtec's participation at the International Microwave Symposium (IMS) 2023 exposition in San Diego, CA (June 13-15), we are pleased to share this introductory slidedeck -- summarizing our capabilities, value, and product offering as it relates to...