Latest News & Press Releases
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IEEE IMS International Microwave Symposium 2019
IEEE IMS International Microwave Symposium 2019
Booth 237
June 4-6
Boston Convention Center
Boston, MA
APEC 2019
APEC 2019
Booth 235
March 18-20
Anaheim Convention Center
Anaheim, CA
SPIE Photonics West 2019
SPIE Photonics West 2019
Booth 5570
February 5-7
Moscone Convention Center
San Francisco, CA
Remtec Introduces High Definition Etchable Thick Film (HDTF) Gold Process on Ceramic
Norwood, MA. February 15, 2018. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has commercialized etchable gold thick film process for High Definition Thick...
Remtec Adds Gold Tin Plated Ceramic Combo Lids to Complement its Ceramic SMT Packages
Norwood, MA. May 12, 2017. RemtecInc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submountsusing PCTF®(Plated Copper on Thick Film) metallization, has added gold tin plated Ceramic Combo Lids to its line of ceramic SMT packages. Now...
Remtec Expands Power Transfer Via (PTV) Technology To DBC Substrates.
Norwood, MA. March 24, 2017. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond...