Latest News & Press Releases
Stay up to date with Remtec, Inc.
New Web Site Strengthens Remtec’s Position as a Leader in Providing Ceramic Packaging Solutions for Demanding Power Electronic Applications
Norwood, MA, June 9, 2014. Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper On Thick Film (PCTF®) metallization, has completed a new, comprehensive web site www.remtec.com that strengthens Remtec’s position as the leader in...
Remtec Develops New, Cost-Effective Gold Tin Plating Technique
Norwood, MA, April 30, 2014. Remtec® Inc., the leading manufacturer of substrates and packages using Plated Copper On Thick Film
Remtec Expands its Enhanced Power Transfer Via (PTV™) Technology into Demanding Electronic Packaging Applications for RF & DC Power Modules
Norwood, MA, November 1, 2012. Remtec, the leading manufacturer of substrates and packages with Plated Copper on Thick Film (PCTF®) metallization, has expanded its copper plated Power Transfer Via (PTV)™ technology into demanding electronic packaging applications...
Remtec Expands DBC Substrate Capabilities, Provides Fast Prototyping and Delivery of Low/Medium Volume DBC Substrates for Power Applications Worldwide.
Norwood, MA, April 30, 2012. Remtec®, the leading manufacturer of substrates and packages with Plated Copper On Thick Film (PCTF®), has significantly expanded its activity in the design and fabrication of DBC ceramic products for military and commercial applications...
Remtec’s New Universal Finish Assures Lower Cost, Better Performance, Improved Quality And Consistently Higher Yields In Production Of Metallized Ceramic Substrates
Norwood, MA April 6, 2012. Remtec Inc., a leader in ceramic substrates and packages based on Plated Copper on Thick Film (PCTF) technology, has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its...
Remtec Expands its Submount Offerings for Packaging of Laser Diodes, LEDs and Photo Diodes
Norwood, MA. December 15, 2011. Remtec, Inc., a leading supplier of ceramic packaging solutions with Plated Copper on Thick Film (PCTF) technology, has added new capabilities for Laser Diode, LED and Photo Diode submounts and substrates.