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Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities.

Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities. Norwood, MA, January 19 2015. Remtec Inc.(www.remtec.com), the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options. Solder mask options include liquid photo image-able LPI for higher resolution patterns, high operating temperature (400oC) solder mask and elevated reflectivity mask for high luminance requirements typical for LED applications. Finally, Remtec complements DBC substrate fabrication with assembly capabilities including flying leads and pin/lug attachment onto metallized ceramics using CuSIL (copper-silver alloy) brazing and AuSn (gold tin) soldering. Remtec offers a wide variety of DBC products on alumina and aluminum nitride with many versatile copper finish options including selective gold tin to ensure excellent solderability, wire bondability and product reliability. The use of palladium plating enables economical assembly techniques including SMT soldering, low and high temperature die attach, aluminum wire, gold wire and ribbon bonding. Now designers can utilize front-to-back connections, wire and terminal connections, flow-controlling solder mask and lead, pin and lug attachments on DBC substrates. Added DBC capabilities allow Remtec to address more applications in defense, aerospace, industrial power, medical instrumentation and green technologies. Remtec, a RoHS compliant, ISO 9001:2008 registered and ITAR compliant company, operates a manufacturing facility totaling 33,000 sq. ft. in Norwood, MA. Remtec provides custom and semi-custom packaging...

Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JEDEC TO-Style Window Lids for Optoelectronic Circuits

Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JEDEC TO-Style Window Lids for Optoelectronic Circuits. Norwood, MA, December 23. 2014. Remtec Inc.,(www.remtec.com) the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has applied its time proven leadless ceramic SMT substrate technology to the development of a new line of standard SMT leadless packages for electro optical circuits matching standard TO type window lids. These new packages address the longstanding demands of the photonics industry for an SMT packaging solution as a viable alternative to standard TO type packages. Now standard economical surface mounted packages can be produced for a wide range of circuits and I/O configurations fully compatible with most of JEDEC TO-style window caps such as TO-8, TO-46 and beyond at operating frequencies up to 10 GHz and higher. This approach reduces the total design cycle, minimizes tooling and engineering costs and reduces end user assembly costs. Remtec’s ability to use standard TO-style lids on a surface-mountable substrate eliminates the need for through-hole mounting of the device on the PCB. More importantly, the device assembly can be done in multiple up panel format resulting in additional cost savings. Remtec’s new SMT packages for optoelectronic circuits are based on extensive experience in design and manufacturing of various products for RF, photonics and other industries. Remtec’s expertise in the design and fabrication of RF substrates and packages complements its capability in the fabrication of substrates and submounts for laser and photo diodes, LEDs, sensors and detectors. This experience extends to a broad use of its PCTF® technology for surface mounted...

Remtec Expands LED Packaging Capabilities And Adds New Economical Metallization Technologies, Custom Tailored for Specific Customer Requirements

Norwood, MA, November 3, 2014. Remtec Inc., the leading manufacturer of substrates and packages using PCTF® (Plated Copper On Thick / Thin Film) metallization, has expanded its LED substrate and submount design and manufacturing capabilities by adding new features such as bond-pad down (flip-chip) packaging with a cathode-anode gap as small as 75-50μ and selective gold-tin plating. As a result, Remtec can now produce higher performance, lower cost metallized LED substrates and submounts using added benefits, each custom tailored to a specific customer requirement matching the required performance and power level or assembly methods. Remtec LED substrates and submounts utilize a variety of metallization technologies on alumina, AIN and BeO ceramics: PCTF® with 20-75μm copper, AgENIG® (Electroless Nickel and Immersion Gold over Silver) and DBC (Direct Bond Copper) with 125-250μm copper. Remtec has developed LED substrates for bond-pad down devices allowing “narrow gap” capability for 50 μm wide gaps suitable for InGaN, GaAs and other LED devices. It enables direct eutectic dieattach, eliminating the need for wire bonds and ensures superior thermal and electrical performance for the next generation of solid-state LED devices. Remtec’s lower cost, high performance gold tin plating that is selectively applied over basic metallization eliminates bulky solder preforms and ensures void-free solder joints in LED substrates and submounts. Finally, using these new capabilities and refined manufacturing techniques, Remtec is able to offer LED assembly manufacturers reliable solutions, competitive pricing, low upfront tooling costs and fast turnaround times without any compromise in quality or performance. In addition to traditional LED lighting markets, Remtec is expanding LED substrates and submounts for non-invasive medical diagnostics, dental, printing and other...

New Web Site Strengthens Remtec’s Position as a Leader in Providing Ceramic Packaging Solutions for Demanding Power Electronic Applications

Norwood, MA, June 9, 2014. Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper On Thick Film (PCTF®) metallization, has completed a new, comprehensive web site www.remtec.com that strengthens Remtec’s position as the leader in providing ceramic solutions for power electronics, optoelectronics and RF/MW applications.  The new site  provides a simple graphic overview of  company capabilities and products starting from its core PCTF® technology products such as leadless ceramic SMT chip carriers, substrates and packages (hermetic and non-hermetic), laser and photodiode submounts and LED submounts.  It also describes other Remtec added-value ceramic technologies: low cost AgENIG® substrates, high density thick films and direct bond copper.  Any of  these categories can be quickly accessed and provide the engineer with examples, photos and drawings as well as complete technical data in a wide range of commercial, industrial and military industries. For those circuit designers and engineers desiring more detailed support, there is quick access to general design rules, DBC design rules, process capabilities and technical articles.  For prospects and customers interested in manufacturing capabilities, the simple link provides a complete view of operations including state-of-the-art automated thick film processing, electroplating and autocatalytic plating, a class 100,000 clean room and the latest quality control equipment.  Navigation throughout the site is intuitive, the data is fast loading and presented clearly, and the opportunity for additional information and support is readily available. Remtec, a RoHS compliant and ISO 9001:2008 certified company, operates a manufacturing facility totaling 33,000 sq. ft. in Norwood, MA.  Remtec provides custom and semi-custom packaging solutions for RF/MW products, power electronics, optoelectronics and other high density circuitry in...

Remtec Expands its Enhanced Power Transfer Via (PTV™) Technology into Demanding Electronic Packaging Applications for RF & DC Power Modules

Norwood, MA, November 1, 2012. Remtec, the leading manufacturer of substrates and packages with Plated Copper on Thick Film (PCTF®) metallization, has expanded its copper plated Power Transfer Via (PTV)™ technology into demanding electronic packaging applications required in RF & DC power circuits, ranging from chip scale packages to power...