Remtec and LTI Merge Metallized Ceramic Packaging and Glass-To Metal Packaging Capabilities to Expand Product Offerings to Sensor Markets.

by remtec1 | Jun 2, 2016 | News, Press Releases

Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal packaging capabilities of parent company, LTI (www.legacytechnologies.com).

Remtec Adds Assembly Capability On Its Metallized Ceramic Substrates And Packages.

by remtec1 | Mar 14, 2016 | News, Press Releases

Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF®(Plated Copper on Thick Film) metallization, has significantly expanded its assembly capability on its metallized ceramic substrates and packages.

Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities.

by remtec1 | Jan 20, 2015 | News, Press Releases

Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JEDEC TO-Style Window Lids for Optoelectronic Circuits

by remtec1 | Jan 8, 2015 | News, Press Releases

Remtec Expands LED Packaging Capabilities And Adds New Economical Metallization Technologies, Custom Tailored for Specific Customer Requirements

by remtec1 | Nov 13, 2014 | News, Press Releases