by remtec1 | Mar 14, 2016 | News, Press Releases
Norwood, MA. March 10, 2016. Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF®(Plated Copper on Thick Film) metallization, has significantly expanded its assembly capability on its metallized ceramic...
by remtec1 | Jan 20, 2015 | News, Press Releases
Remtec Expands Direct Bond Copper (DBC) Product Offerings Adding Copper Filled Vias, Copper Bore Coated Holes, Solder Mask and Assembly Option Capabilities. Norwood, MA, January 19 2015. Remtec Inc.(www.remtec.com), the leading manufacturer of substrates and packages...
by remtec1 | Jan 8, 2015 | News, Press Releases
Remtec Introduces New Leadless Ceramic SMT Packages Compatible with Standard JEDEC TO-Style Window Lids for Optoelectronic Circuits. Norwood, MA, December 23. 2014. Remtec Inc.,(www.remtec.com) the leading manufacturer of substrates and packages using PCTF® (Plated...
by remtec1 | Nov 13, 2014 | News, Press Releases
Norwood, MA, November 3, 2014. Remtec Inc., the leading manufacturer of substrates and packages using PCTF® (Plated Copper On Thick / Thin Film) metallization, has expanded its LED substrate and submount design and manufacturing capabilities by adding new features...