by remtec1 | Jan 4, 2019 | News, Press Releases
APEC 2023 Booth 227 March 19-23 Orange County Convention Center Orlando, FL
by remtec1 | Jan 4, 2019 | News, Press Releases
SPIE Photonics West 2023 Booth 2348 January 23 – February 2 Moscone Convention Center San Francisco, CA
by remtec1 | Apr 6, 2018 | News, Press Releases
Norwood, MA. February 15, 2018. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has commercialized etchable gold thick film process for High Definition Thick...
by remtec1 | Jun 7, 2017 | News, Press Releases
Norwood, MA. May 12, 2017. RemtecInc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submountsusing PCTF®(Plated Copper on Thick Film) metallization, has added gold tin plated Ceramic Combo Lids to its line of ceramic SMT packages. Now...
by remtec1 | Mar 27, 2017 | News, Press Releases
Norwood, MA. March 24, 2017. Remtec Inc. (www.remtec.com) the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has expanded its enhanced Power Transfer Via (PTV®) technology to Direct Bond...
by remtec1 | Jun 2, 2016 | News, Press Releases
Norwood, MA. May 31, 2016. Remtec Inc. (www.remtec.com), the leading manufacturer of ceramic substrates, packages and submounts using PCTF® (Plated Copper on Thick Film) metallization, has merged its metalized ceramic packaging capabilities with the glass-to-metal...